On the thermal conductivity, the same thermal conductivity of solid thermal materials, thermally conductive silicone film is certainly not as good as the liquid thermal conductive materials, but some customers feel that the liquid thermal conductive materials are not good after use, for this situation, the preliminary estimate is that the application of several problems.
1、Application thickness.
Many customers in the application of thermal conductive gel did not care about the thickness, I have encountered this situation, customers in the use of non-silicone oil thermal conductive gel point 3mm thickness, the effect did not meet expectations, the conclusion is that this thermal conductive gel material is not good. Our company recommends that the application principle for paste material is the thin thickness and even application. Thick material means the efficiency of heat transfer is low and heat dissipation is slow; even application can avoid residual air and reduce thermal resistance.
2. Effective contact.
When assembling try to maintain a certain pressure, so that the thermal conductive gel and heat dissipation material contact more closely, both to fill the tiny gaps, but also to discharge air, as much as possible to increase the effective contact surface.
3. Heat sink effectiveness.
Many customers only focus on the thermal conductivity material and do not think about whether the heat sink is suitable. For example, the customer began to use the power supply on the 2.0W / mK material, thermal conductivity barely meet the requirements, the customer wants to improve the next, to achieve better results, the use of a 5.0W / mK thermal conductivity material, but the results are very unexpected, the two thermal conductivity difference between the material thermal conductivity is not significant. Firstly, the material was ruled out as it had been verified by many customers and applied without problems. The surface of the material was flat and wrinkle-free, indicating good effective contact, and the reason was judged to be the heat sink. Because the heat sink was small, it was already performing as well as it could when using 2.0W/mK thermal conductive material, even with 20W/mK thermal conductive material. When the customer verifies this with a larger heat sink, the results are significantly higher.
