Industry dynamic

Thermally Conductive Interface Materials

Thermally conductive interface materials have been commonly used in all heat sink modules to fill the tiny gaps and the uneven surface holes that exist between the surface of electronic materials and the heat sink when they touch, which would otherwise seriously hinder the heat transfer. With the pursuit of high power performance in electronic products, thermal interface materials not only pursue thermal conductivity, but also reliability and reduction of thermal resistance at the interface, which is an extremely important issue.
The types of thermally conductive interface materials include thermally conductive silicone film, thermally conductive tape, thermally conductive paste and thermally conductive mastic. By filling the gap between the heat source of the chip and the heat sink, the heat energy is accelerated and effectively transferred to the heat sink fins, lowering the chip temperature and increasing the chip life and product performance.

  • All heat dissipation begins with thermal conduction.
When new electronic products are introduced, depending on the process capability of the production side and the needs of the market side: IC process and chip performance, wattage has increased significantly, and the user experience must be balanced with the pursuit of thin, light, short and efficient, resulting in a high unit density of heat on the surface of the heat generating components, which is continuously transferred to the heat sink by heat conduction. The heat balance is achieved without overloading the components of the product.
The contact surfaces of the different components of the product produce contact surfaces and when heat is conducted, there is a so-called thermal resistance of the interface to be considered. TIM (Thermal Interface Material) is used to fill the micro voids and uneven surface holes created when two materials meet or come into contact, reducing the resistance to heat transfer.

The choice of thermal interface materials with different characteristics can be used to select the most suitable thermal resistance, heat flux, compressibility, softness, hardness, etc. for different product designs. This is a key consideration in the early stages of product design.

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