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Analysis of thermally conductive interface materials

Electronic devices are widely used in the experience is the user's first choice of equipment conditions, and electronic equipment operation in the impact of its reliability is one of the key factors is the operating temperature, heat dissipation products is one of the key research content of industrial enterprises, the emergence of thermal conductive materials to many electronic industry has increased hope.

The progress of electronic equipment is rapid, and with its increased functionality, there are quite a few new problems. The heat generated by electronic equipment is a relatively distressing thing for users, and the thermal conductivity of the system is incorporated into the conditions for considering the equipment, and thermally conductive interface materials are thus born.A basic overview of thermally conductive interface materials|Analysis of the role, types, characteristics and selection of thermally conductive interface materials

  • What are thermally conductive interface materials?

Thermally conductive interface materials, also known as thermal interface materials or interface thermal conductive materials, are a common material used in IC packaging and electronic heat dissipation, mainly to fill micro voids and
 uneven surface holes created when two materials are joined or contacted, to reduce heat transfer contact thermal resistance and improve device thermal performance.

In the microelectronic material surface and heat sink between the existence of very small uneven gaps, if they are installed directly together, the actual contact area between them is only 10% of the heat sink base area, the rest are air gaps.Because the thermal conductivity of air is only 0.024W/(m*K), it is a poor conductor of heat, which will result in a very high thermal resistance of contact between the electronic components and the heat sink, seriously hinderingthe conduction of heat and ultimately causing the heat sink to be ineffective.

The use of highly thermally conductive thermal interface materials to fill these gaps and remove the air from them, creates an effective heat transfer path between the electronic components and the heat sink, significantly reducing the contact thermal resistance and allowing the heat sink to be fully utilised. Thermal interface (contact surface) materials play a very critical role in thermal management and are an important branch of research in this discipline.

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