For electronic sealants, after complete curing, they show a variety of properties and are applicable in many fields. During the curing process, the speed can be fast or slow, which has a great impact on the performance. It is important to understand the factors that affect the curing speed so that it can be used smoothly.
For a good quality electronic potting adhesive, it should have good thixotropy. This is a basic performance, with good thixotropy, it can be quickly squeezed out or sprayed, without delaying the operation time. After the fast operation, the color remains the same and the performance remains the same.
The demand for electronic sealants in the medical, automotive and electronic industries is increasing day by day and they are indispensable in the production process. This adhesive has excellent characteristics and is very durable to achieve the desired use.
Thermal conductive paste as a heat dissipation material has been widely used, the field involves electrical appliances, electronics, automotive, and other fields, with excellent heat transfer performance, become irreplaceable products. High thermal conductivity is not like an adhesive, with adhesive after use, good adhesion better performance.
The sealant is a kind of glue that can change shape with the shape of the sealing surface, the main characteristic of this glue is that it is not easy to flow and convenient for construction. After curing, it can not only play the role of sealing, but also has good adhesive performance, but during the construction, the one-component sealant is thin and has the phenomenon of flowing, is it related to the quality?
Thermal conductive grease is mainly used for heat dissipation, mainly filling between CPU and heatsink in order to play the expected heat dissipation performance, to avoid the CPU can not timely heat dissipation and burn, this material presents a paste state, without waiting for the curing can be the next construction. Some users find that the nature of the thermal grease is sticky and will not work, can I dilute it myself?