With the electronic industry products more and more sophisticated, the size of components and PCB board and product diversification, came into being some electronic accessories, of which solder paste and SMT patch red glue are indispensable materials in the electronic industry, what is the difference between the two products, the following content will give you the answer.
Common issues in glue scraping and dispensing include overflow, glue not falling off the scraper, insufficient glue amount, and glue collapse, often related to glue viscosity, mesh width, or environmental conditions. In dispensing, problems like stringing, missing glue spots, inconsistent dot sizes, and satellite dots may be caused by glue viscosity, dispensing pressure, or needle distance. Component drop-offs may result from glue quality, incomplete curing, or PCB issues. Solutions include selecting the correct glue type, adjusting the curing profile, and conducting push tests to ensure complete curing.
In the manufacturing industry, thermal grease is relatively common. This material not only dissipates heat but also has insulating properties. It is a heat-dissipating and non-conductive material. Because this material has high requirements for the coating process and is mainly thin and light, what will happen if too much is applied? Is there any countermeasure?
The application field of adhesives is getting higher and higher, and it has become an indispensable material in the manufacturing industry. The richer the performance of adhesives, the higher the application field. silicone potting can be cured at room temperature or heated during the curing stage, which can meet different curing requirements. Can all silicone potting be cured by heating?
Potting glue is used in many fields, such as electronic component potting and electrical component potting. The potted electrical or electronic products have waterproof, moisture-proof, insulating and sealed properties. Mistakes are inevitable during construction. What should I do if I encounter such a situation?
one-component sealant is in paste form and is easy to apply. It can be directly applied to the substrate to complete the bonding, and it can also be applied for construction. It will not flow during construction. The colloid has good elasticity after curing, which can meet the bonding and fixing needs of most substrates.
