Tensan 4109A is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . Cold storage 4109A to be rewarmed before use, 30ml syringe to be 1 hour, 300ml 24 hours. Storage tank or dispensing mouth temperature at 25℃-30℃ can help improve the high-speed dispensing effect.
Today Shenzhen Tensan is going to share the the concept of thrmally conductive pad. Thermally conductive silicone pad is one of the widely used thermal interface materials. It is in the form of a sheet, with high compressibility, high reliability, high temperature resistance, excellent thermal conductivity and insulation. The surface is self-adhesive, and the construction is simple and convenient. According to the size and shape of the heating device, the die-cutting die can be arbitrarily.
Tensan TS8800 silicone 1 to 1 encapsulant is supplied as two part liquid component kits. After mixing, two parts silicone will be cured as a flexible elastomer, which is well used for the protection of electrical and PCB system assemble application. The duration of application and the curing time at room temperature are independent of the number of materials. Its application is as following : Application
Adhesives application are widely in all aspects , we mainly meet the common adhesive in daily life, but it is also used in many fields such as construction and industry. Here are few common methods of adhesive application in industry:
Do you know what is adhesive? Just as its name implies, to bond the item.So what is the future development of China's adhesive industry? Let's take a look at this talk with Shenzhen Tensan company .
There are some application problems will inevitably occur during the use of encapsulant, such as volume expansion after curing; curing process is slow in winter; encapsulant removal issues after curing, etc. Shenzhen Tensan will show us in specific for the application problems and offer solutions .
