TENSAN offers two advanced no‑clean solder flux formulations through its TS‑506 and TS‑501 solder pastes. Each is engineered to address specific manufacturing requirements – from high‑reliability automotive and server applications to heat‑sensitive LED and flexible PCB assemblies. Both products feature advanced No‑Clean Solder Flux chemistry that delivers excellent wetting, low voiding, stable printing, and transparent, non‑conductive residues – all while eliminating cleaning steps and reducing production costs.
No-Clean Solder Flux – TENSAN TS-506 & TS-501 Solder Paste Solutions
In modern SMT assembly, the choice of solder flux is just as critical as the alloy itself. The solder flux determines wetting performance, voiding levels, residue characteristics, and long‑term reliability of the finished assembly. No‑clean solder flux has become the industry standard for high‑volume production, eliminating the need for post‑reflow cleaning while maintaining excellent electrical reliability and corrosion resistance.
TENSAN offers two advanced no‑clean solder flux formulations through its TS‑506 and TS‑501 solder pastes. Each is engineered to address specific manufacturing requirements – from high‑reliability automotive and server applications to heat‑sensitive LED and flexible PCB assemblies. Both products feature advanced No‑Clean Solder Flux chemistry that delivers excellent wetting, low voiding, stable printing, and transparent, non‑conductive residues – all while eliminating cleaning steps and reducing production costs.
What Is No-Clean Solder Flux?
No‑clean solder flux is a formulation designed to leave minimal, non‑corrosive, and non‑conductive residues after reflow – residues that do not require removal in most applications. Unlike water‑soluble or rosin‑based fluxes that must be cleaned to prevent corrosion or leakage, no‑clean solder flux is engineered to remain on the board safely, supporting ICT testing and long‑term reliability.
Key characteristics of high‑quality no‑clean solder flux include:
TENSAN's no‑clean solder flux formulations in TS‑506 and TS‑501 deliver all these characteristics, making them trusted choices for manufacturers across automotive, telecommunications, consumer electronics, and industrial sectors.
Alloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Why Choose TENSAN No-Clean Solder Flux?
1. Superior Electrical Reliability
The solder flux residue from TS‑506 and TS‑501 maintains exceptionally high SIR values, well above industry thresholds. TS‑506 achieves ≥5.0×10⁸ Ω at 85°C/85% RH, while TS‑501 exceeds 1.7×10⁹ Ω under the same conditions. Furthermore, TS‑501 passes the rigorous Bellcore electromigration test (500 hours at 65°C/85% RH, 10V bias), confirming that the solder flux residue will not cause leakage or dendritic growth over the product’s lifetime – a critical requirement for automotive and telecom infrastructure.
2. Halogen‑Free and Low‑Halogen Options
Environmental regulations and customer specifications increasingly demand low halogen content. TS‑506’s solder flux is L0‑grade, containing less than 500 ppm halogens – qualifying as halogen‑free. TS‑501 keeps halogens below 1500 ppm, still comfortably within most restrictions. This flexibility allows manufacturers to choose the right solder flux for their compliance needs without sacrificing performance.
3. Non‑Corrosive, Dry Residue
Both solder flux systems pass the copper mirror test with no penetrating corrosion (L grade for TS‑506, PASS for TS‑501). The residue is dry and non‑tacky, preventing dust attraction and ensuring compatibility with conformal coating and automated handling. This dry characteristic also simplifies visual inspection and AOI, as the residue does not obscure component markings.
4. Excellent Wetting and Low Voiding
Despite being no‑clean, these solder flux formulations provide strong wetting on all common PCB finishes – ENIG, OSP, HASL, immersion silver, and immersion tin. They also minimise voiding, especially on large thermal pads, enhancing thermal conductivity and mechanical strength. This balance of cleanability (or rather, non‑cleanability) and soldering performance is a hallmark of TENSAN’s solder flux expertise.
5. Stable Printing and Long Stencil Life
The rheology of TENSAN’s no‑clean solder flux is optimised for consistent printing over extended runs. Both TS‑506 and TS‑501 maintain viscosity for more than 8 hours on the stencil under normal shop‑floor conditions (22‑28°C, 30‑60% RH). This reduces cleaning frequency, minimises paste waste, and ensures high first‑pass yields – directly contributing to lower cost per assembly.
Stencil Design Guidelines
Printing Conditions
Reflow Profile (Recommended)
Storage and Handling Guidelines for This Solder Paste
Typical Applications
TENSAN no‑clean solder flux is trusted across a wide spectrum of industries:
Quality Assurance
Each batch of TENSAN no‑clean solder flux (as part of TS‑506 or TS‑501) is supplied with a Certificate of Analysis detailing:
This ensures consistent solder flux performance from lot to lot, giving you confidence in every production run.
Frequently Asked Questions
Q: What is the main advantage of no‑clean solder flux over water‑soluble?
A: No‑clean solder flux eliminates the need for post‑reflow cleaning, reducing process steps, chemical costs, and cycle time. It is ideal for high‑volume production where the residue is proven safe. In contrast, water‑soluble solder flux requires thorough cleaning and is reserved for ultra‑clean applications.
Q: Is the residue from TENSAN no‑clean solder flux conductive?
A: No. The solder flux residue is non‑conductive, with SIR values far exceeding IPC requirements. It supports ICT and functional testing without any cleaning.
Q: Does TENSAN offer a halogen‑free no‑clean solder flux?
A: Yes, TS‑506 is L0‑grade with <500 ppm halogens, making it a true halogen‑free solder flux. TS‑501 is low‑halogen with <1500 ppm. Both meet strict environmental and reliability standards.
Q: Can I use no‑clean solder flux for automotive applications?
A: Absolutely. Both TS‑506 and TS‑501 are widely used in automotive ECUs, sensors, and BMS modules, passing rigorous SIR, corrosion, and electromigration tests.
Q: What is the shelf life of TENSAN no‑clean solder paste?
A: Six months from production date when stored at 2–10°C (TS‑506) or 5–10°C (TS‑501).
Q: Does no‑clean solder flux require special stencil cleaning?
A: Regular under‑stencil cleaning with isopropyl alcohol (IPA) or standard cleaning solvents is sufficient. The long stencil life (>8 hours) reduces cleaning frequency.
Conclusion
Selecting the right solder flux is pivotal for achieving high yields and long‑term reliability in SMT assembly. TENSAN’s No‑Clean Solder Flux – available in TS‑506 and TS‑501 – delivers an unmatched combination of low residue, high SIR, non‑corrosiveness, and excellent printability. Whether you need a halogen‑free, standard‑temperature solder flux for automotive modules or a mid‑temperature solder flux for heat‑sensitive LED boards, TENSAN has a proven solution. By eliminating cleaning steps and ensuring robust electrical performance, this solder flux technology helps you reduce costs, improve throughput, and meet the most stringent quality standards.
Choose TENSAN No‑Clean Solder Flux – where innovation meets reliability.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
