TS-350 is a lead-free, no-clean solder paste based on SAC305 alloy, with a melting point of 221–227°C, Type 4 powder size (20–38 μm), flux content of 10.5±0.5%, viscosity of 220,000 mPa·s, and halogen content meeting L0 level. Key Advantages: Stable printing with excellent shape retention, supporting ultra-fine pitch down to 0.28mm; strong wetting performance, low voiding, minimal residue, compatible with air/nitrogen reflow; effective head-in-pillow (HiP) resistance for improved first-pass yield; RoHS compliant. Storage: Refrigerate at 2–10°C (do not freeze), 6-month shelf life. Allow 4+ hours of sealed warm-up before use, followed by 1–2 minutes of mixing. Applications: Consumer electronics, automotive electronics, industrial controls, telecommunications, medical devices, LED lighting.
In SMT assembly, the journey to a flawless solder joint begins long before the stencil touches the PCB—it starts with proper paste preparation. A high-quality solder paste mixer is essential for restoring the paste's homogeneous consistency after refrigeration, ensuring that the flux, alloy powder, and rheological additives are evenly distributed. TS-350 is engineered to respond optimally to standard mixing protocols, delivering consistent print performance batch after batch when properly prepared with a reliable solder paste mixer.
In the fast-paced world of electronics manufacturing, every production line faces the same critical challenges: achieving consistent print quality, minimizing defects, and maintaining high first-pass yields. As component geometries shrink and PCB designs grow more complex, the solder paste you choose—and how well it is prepared using your solder paste mixer—directly determines your production efficiency and product reliability.
High-performance solder paste featuring outstanding printability and superior wetting performance is precisely what TS-350 delivers—a lead-free, no-clean solder paste engineered specifically for manufacturers demanding ultra-fine pitch capability without compromising on soldering quality. Its formulation is designed to recover its ideal rheological state quickly and uniformly when processed through a standard solder paste mixer, eliminating the risk of inconsistent viscosity caused by inadequate mixing or settling during storage.
Whether you're running high-volume production or specialized rework operations, TS-350 provides the stability, consistency, and wetting characteristics that today's SMT assembly lines require. When properly mixed with a calibrated solder paste mixer, TS-350 achieves optimal flux dispersion and powder distribution—ensuring that every printed deposit has the same flux activity and metal loading, regardless of where the paste was drawn from the jar.
Alloy Composition
Physical & Electrical Properties
Core Features and Benefits
1. Outstanding Print Performance
TS-350 delivers High-performance solder paste featuring outstanding printability and superior wetting performance consistently across long production runs, with a formulation that responds reliably to the mixing action of your solder paste mixer.
2. Superior Wetting and Soldering Quality
Wetting performance directly affects joint reliability. TS-350's flux chemistry ensures rapid and complete wetting on various surface finishes.
3. Minimal Residue and Clean Solder Joints
4. Excellent Head-in-Pillow (HiP) Resistance
QFN and BGA assemblies are susceptible to head-in-pillow defects. TS-350 is specifically formulated to resist this failure mode, improving first-pass yields on in-line testing.
5. RoHS Compliance
Fully compliant with RoHS Directive 2002/95/EC, ensuring regulatory compliance for electronics exports to global markets.
Storage Conditions
Handling Procedure
Recommended temperature
Safety Considerations
Quality Assurance
Each batch of TS-350 is accompanied by a Certificate of Analysis covering:
Our quality system ensures consistent product performance from lot to lot, giving you confidence in your production process. To maintain batch-to-batch consistency during paste preparation, we recommend establishing a standard operating procedure for your solder paste mixer—including fixed mixing time, speed, and temperature conditions—to eliminate operator-dependent variability.
Typical Applications
TS-350 is designed for:
Frequently Asked Questions
Q: Can TS-350 be used for both standard and fine-pitch printing?
A: Yes. High-performance solder paste featuring outstanding printability and superior wetting performance is formulated to perform equally well on standard 0.5 mm pitch and ultra-fine 0.25 mm (10 mil) pitch applications. Prior to fine-pitch printing, ensure your solder paste mixer has thoroughly homogenized the paste—inadequate mixing can lead to flux-rich or powder-rich deposits that compromise fine-feature definition.
Q: What is the recommended stencil for TS-350?
A: ALPHA® Stencils or equivalent high-quality laser-cut stainless steel stencils are recommended for optimal release and shape retention.
Q: Does TS-350 support paste-in-hole (PiH) applications?
A: Yes, TS-350 is suitable for paste-in-hole processes.
Q: How long can TS-350 sit on the stencil during production?
A: With its stable viscosity and excellent stencil life, TS-350 maintains print performance throughout typical production shifts. Always reseal unused paste to maximize its usable life.
Q: What mixing parameters are recommended for TS-350 with a solder paste mixer?
A: For centrifugal (vacuum) mixers, we recommend 3–5 minutes at 1,200–1,500 RPM. For planetary mixers, 15–20 complete rotations at low-to-medium speed is typically sufficient. Always avoid over-mixing, which can generate excessive heat and alter the paste's rheological properties. If you are uncertain about your specific solder paste mixer model, our application engineers can provide tailored mixing recommendations based on your equipment.
Conclusion
Choosing the right solder paste is one of the most critical decisions in SMT assembly. TS-350 delivers everything you need: consistent printing, superior wetting, minimal residue, and proven reliability across a wide range of applications. But even the best paste requires proper preparation—a well-calibrated solder paste mixer is your first line of defense against viscosity inconsistency, powder settling, and flux separation. Proper mixing ensures that the TS-350 you apply to the stencil is exactly the same high-performance material that passed our rigorous quality testing.
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 helps you achieve:
For manufacturers seeking a stable, high-quality lead-free solder paste that bridges the gap between tin-lead legacy processes and today's demanding lead-free requirements, TS-350 is the proven choice. Our application engineering team is available to help you develop optimized mixing protocols for your specific solder paste mixer model, ensuring that your paste preparation process is as consistent and reliable as the paste itself.Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84-222-650-8818
Email: mark@sztensan.com
For inquiries regarding alternative alloys, custom packaging, or solder paste mixer selection, mixing parameter optimization, and process validation, please contact your local Tensan sales office.
