CPU Thermal Pad
Heat Sink Pad
Features & Benefits Tensan High Quality SMT Red Glue Material is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use
