Thermall Pad for UPS Manufacturers

CPU thermal grease is a silicone grease-like material that can conduct heat quickly and dissipate, and this material will not cure after being applied or coated, which can ensure the power tubes, electric heating stacks, and thyristors in electrical equipment. The contact surface between the heat dissipation facilities is mainly to play the role of heat dissipation, and can also achieve the characteristics of moisture-proof, corrosion-proof, and dust-proof, which can well protect the normal operation of the cup.

Silicone potting glue is a kind of potting glue product with good adhesion. It has outstanding performance advantages, can achieve good adhesion with many substrates, and has good sealing performance. It has gradually been recognized by the industrial field and has been It is widely used in the bonding and potting of precision electronic components, solar energy and other devices.

As we know, among the thermally conductive raw materials, thermally conductive pads are mainly composite materials based on silicone raw materials, which are very commonly used. However, due to the diversification of the use of silicone management systems, a widespread risk of volatilisation and oil leakage is gradually becoming a concern.

This report centers on the comparison between Tensan Red Glue and other red glues. Tensan Red Glue shows superiority in performance. It has excellent viscosity, rapid curing with good heat and chemical resistance, precise glue dot control, favorable cleaning property and high reliability. In contrast, other glues have drawbacks like unstable viscosity and weak resistance in harsh conditions. Regarding cost-effectiveness, Tensan Red Glue boosts production efficiency and cuts waste. In application, it suits consumer electronics, automotive electronics and industrial control where high performance and reliability are essential, while others are restricted in such fields. Enterprises should consider multiple factors for glue selection.

When some users choose silicone sealants, they focus on the curing speed. I think the faster the curing speed, the more time I save. Is this really the case? You might as well understand the curing speed, and don't affect the curing effect just to meet the deadline.

Some users choose electronic potting glue, wanting to make it play a good thermal conductivity. For most potting adhesives, it has excellent thermal conductivity and can meet the needs of the majority of users. So, how to judge whether the thermal conductivity of an adhesive is good or not?