Thermall Pad for UPS Manufacturers

How to prevent the encapsulant from drying out or drying slowly? This situation is mainly manifested in that after the encapsulant is cured, it is still soft when pressed by hand, and it has not completely hardened. Next, Shenzhen Tensan will talk about how to avoid the situation where the potting glue is not dry?

TIMs (Thermal Interface Materials) are designed to conform to surface irregularities, eliminate air gaps, and improve heat flow. Thermal conductive sealant is one of the categories of TIM that provides a combination of low thermal resistance and high bond strength. Using this process, heat energy is passed through a solid, liquid or gas from molecule to molecule in a material. Improving the heat flow is important because greater the temperature difference, the faster the heat flows to the colder area.

Potting glue is mainly used in the bonding and sealing of electrical components, and can even be used in the overall potting and coating of electrical substrates, the field of use is very wide, as long as the reasonable performance of the use, can show good waterproof, moisture-proof, sealing and other performance, has become one of the indispensable materials for the electrical and electronic manufacturing industry.

The method is very simple is to put the pencil lead into the milky white thermal conductive silica gel grinding, grinding and thermal conductive silica gel mix, such as grinding bad after a certain level, the thermal paste will turn black and grey, then high purity graphite thermal conductive silica gel is made. But to pay attention to one point, in the whole process of making to pay attention to the strength of the grinding pencil, or pencil core particles are very large in turn will affect the actual effect of heat transfer. The same principle of putting creamy heat dissipation paste into the middle of two pieces of aluminium rubbing can also be made of aluminium heat-conducting silicone. In addition, the guys can also try to make their own preservatives for other raw materials, such as tin, copper, etc.

There are many different types of potting adhesives, which can be divided in more detail according to the field of use. Among them, chip potting adhesive is used in a wide range of fields, OS has semiconductor integrated circuits can be used, may I ask chip potting adhesive is good to use? What performance characteristics can be achieved after use?