SnBi solder paste Manufacturers

TENSAN SMT solder paste – TS‑501 is engineered to meet this exact need. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste delivers excellent wetting and soldering performance at a significantly lower melting point than conventional SAC alloys, protecting thermal‑sensitive components while maintaining production efficiency. Whether you run a high‑volume line or a specialised assembly process, this SMT solder paste provides the thermal protection and process stability you require.

Achieve robust, reliable PCB assemblies with our specialized white paste adhesive. Key advantages: Non-Sag Formula for vertical application ease, Excellent Waterproofing & Shock Resistance protecting sensitive electronics, and Easy Dispensing paste consistency. Ideal for securing connectors, transformers, and larger SMDs. Free samples available!

TS107E is a widely used no‑clean, leaded solder paste that is specifically engineered to deliver the highest level of voiding performance in the industry. As an IPC Class III Voiding Performance Solder Paste, it meets the most stringent IPC 7095 Class III requirements for IPC Class III voiding, ensuring superior long‑term reliability in thermal cycling, high‑power, and mission‑critical applications. Beyond its exceptional voiding characteristics, TS107E also offers excellent ultra‑fine pitch printing, low head‑in‑pillow defects, and high in‑circuit probe test yield, making it the preferred choice for manufacturers who demand the highest quality and reliability standards.

TENSAN TS‑506 is a Long‑Lasting High Tackiness Solder Paste for Double‑Sided Reflow. Its advanced flux system is engineered to provide strong initial tack and retain that holding force for extended periods, even after the first reflow and during the second pass. With a balanced low‑silver alloy (Sn98.5Ag1.0Cu0.5), excellent printability, and low voiding, TS‑506 is the ideal high tackiness solder paste for double‑sided reflow for manufacturers seeking reliability and productivity.

TS8866 is a two-component addition-cured silicone gel, specially designed for the production of stress-relief toys. It can cure into a soft and sticky gel at room temperature, and the curing process can be accelerated by heating it to 40-50℃. The product is flexible and soft, meeting the needs of different customer groups and achieving a stress-relief effect.

TS-503 is a lead-free medium-temperature solder paste developed by TENSAN, utilizing the Sn-Ag0.3-Bi35 (Tin-Silver-Bismuth) alloy system with a melting point of approximately 140°C. It is specifically designed for SMT assembly of heat-sensitive components and multi-layer PCBs. This product is precision-engineered with Type 4 (20–38μm) spherical solder powder and an ROL1-grade low-halogen flux system, delivering excellent printability, superior wettability, and high-reliability electrical performance. It is an ideal choice for consumer electronics, LED lighting, automotive electronics, and other related industries.