TENSAN TS‑506 is a Long‑Lasting High Tackiness Solder Paste for Double‑Sided Reflow. Its advanced flux system is engineered to provide strong initial tack and retain that holding force for extended periods, even after the first reflow and during the second pass. With a balanced low‑silver alloy (Sn98.5Ag1.0Cu0.5), excellent printability, and low voiding, TS‑506 is the ideal high tackiness solder paste for double‑sided reflow for manufacturers seeking reliability and productivity.
Long-Lasting High Tackiness Solder Paste for Double-Sided Reflow – TENSAN TS-506
Double-sided reflow assembly has become a mainstream process for compact, high‑density PCBs, especially in smartphones, wearables, and automotive modules. By placing components on both sides of the board, designers save space and reduce layer count. However, the process introduces a critical challenge: when the second side is being reflowed, the components soldered on the first side must stay firmly in place – without shifting, tombstoning, or falling off. This demands a solder paste with exceptionally high and long‑lasting tackiness, capable of withstanding the thermal and mechanical stress of a second reflow cycle.
TENSAN TS‑506 is a Long‑Lasting High Tackiness Solder Paste for Double‑Sided Reflow. Its advanced flux system is engineered to provide strong initial tack and retain that holding force for extended periods, even after the first reflow and during the second pass. With a balanced low‑silver alloy (Sn98.5Ag1.0Cu0.5), excellent printability, and low voiding, TS‑506 is the ideal high tackiness solder paste for double‑sided reflow for manufacturers seeking reliability and productivity.
What Is TENSAN TS‑506?
TENSAN TS‑506 is a no‑clean solder paste for SMT assembly that offers:
TS‑506 is specifically designed to meet the demands of double‑sided reflow, where the high tackiness solder paste for double‑sided reflow must maintain its grip through temperature excursions and component placement delays.
Key Specifications
Alloy & Physical Properties
Electrical & Reliability Properties
Why Choose TENSAN TS‑506 as Your Long‑Lasting High Tackiness Solder Paste for Double‑Sided Reflow?
1. Exceptional and Durable Tackiness for Double‑Sided Processing
Tackiness – the ability of the paste to hold components in place after printing – is measured by tack force and its retention over time. TS‑506’s flux chemistry provides a high initial tack force, and more importantly, it maintains this holding power for several hours after printing. This is critical for double‑sided reflow, where the first‑side components may wait for the second‑side printing and reflow, and then must survive the second reflow profile without shifting. TS‑506 has been validated to retain >90% of its initial tack after 8 hours at room temperature, making it a true high tackiness solder paste for double‑sided reflow. Whether you have long placement times or in‑line buffer delays, TS‑506 keeps components securely in position.
2. Low Voiding – Essential for Both Sides
Voiding is a concern on both the top and bottom sides, especially for QFN, LGA, and power components. TS‑506’s flux system releases volatiles gradually, preventing gas entrapment regardless of the reflow order. This ensures that thermal performance and joint reliability are maintained on both sides – a key advantage for high‑reliability automotive and medical boards.
3. Stable Print Performance – Even for Fine‑Pitch and Mixed Components
Double‑sided boards often include a mix of fine‑pitch BGAs, QFPs, and large passive components. TS‑506’s optimized rheology delivers sharp, consistent deposits for all pad sizes, with minimal slump. This reduces bridging and insufficient solder, ensuring that the first‑side joints are robust enough to withstand the second reflow without re‑melting issues.
4. No‑Clean Residue – Compatible with Secondary Assembly
After the first reflow, the residue remains transparent and non‑conductive, so it does not interfere with the second‑side printing or placement. It also does not hinder the wetting of new paste during the second reflow, avoiding defects like non‑wetting or dewetting. The residue is easily penetrated by ICT probes, maintaining testability without cleaning.
5. Wide Reflow Window – Accommodates Both Sides
The reflow profiles for the two sides may differ due to component thermal mass. TS‑506 offers a generous process window (preheat ≤2.5°C/s, soak 90‑120s, peak 240‑250°C), allowing you to tailor the profile for the bottom side (usually lower temperature) and the top side (often higher temperature). This flexibility is especially valuable in high‑mix production.
Important: Always warm up TS‑506 in its sealed container to prevent moisture condensation. Moisture can reduce tackiness and increase voiding – especially critical for double‑sided processing.
Recommended Temperature Curve
For double‑sided reflow, we recommend using a slightly longer soak for the side with heavier components to ensure even heating and preserve the tackiness of the opposite side during the second pass.
Typical Applications
This Long‑Lasting High Tackiness Solder Paste for Double‑Sided Reflow is ideal for:
In all these applications, the high tackiness solder paste for double‑sided reflow ensures that first‑side components remain in place during the second reflow, reducing rework and improving yield.
Quality Assurance
Every batch of TENSAN TS‑506 is accompanied by a Certificate of Analysis confirming:
Our quality system ensures that tackiness and other key parameters are consistent across batches, so you can rely on TS‑506 for every double‑sided assembly.
Frequently Asked Questions
Q: How long does TS‑506 maintain its tackiness after printing?
A: Under typical shop conditions (20‑25°C, <65% RH), TS‑506 retains high tackiness for more than 8 hours, making it a reliable high tackiness solder paste for double‑sided reflow even with extended placement delays.
Q: Can TS‑506 be used for both sides of the board?
A: Absolutely. It is designed to work on both sides; we recommend printing the side with heavier components first, but the paste performs well in either sequence.
Q: Does the residue affect the second‑side printing?
A: No. The residue is thin, transparent, and non‑wetting, so it does not contaminate the stencil or affect the new paste deposit.
Q: Is TS‑506 suitable for fine‑pitch (0.4 mm) BGA on both sides?
A: Yes, its Type‑4 powder and stable rheology support fine‑pitch printing on both sides, giving you consistent volume and tack.
Q: What is the shelf life of TS‑506?
A: Six months from production date when stored at 2‑10°C.
Q: Does TS‑506 require special reflow profiles for double‑sided?
A: No, but we recommend optimising the profile for each side’s component thermal mass. The wide process window of TS‑506 gives you the flexibility to do so.
Conclusion
Double‑sided reflow assembly demands more than just a standard solder paste – it requires a paste that can hold components securely through multiple thermal cycles and extended waiting times. TENSAN TS‑506 is that paste. As a Long‑Lasting High Tackiness Solder Paste for Double‑Sided Reflow, it combines excellent tack retention, low voiding, stable printing, and reliable electrical performance – all at a cost‑effective low‑silver alloy composition.
By choosing TS‑506, you are selecting the high tackiness solder paste for double‑sided reflow that keeps your components in place, reduces rework, and boosts your overall process yield. Whether you are manufacturing smartphones, automotive ECUs, or medical devices, TS‑506 gives you the confidence to run double‑sided lines with minimal defects.
Partner with TENSAN TS‑506 – where tackiness meets reliability.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
