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Hot Products

  • SMT Solder Paste

    SMT Solder Paste

    TENSAN SMT solder paste – TS‑501 is engineered to meet this exact need. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste delivers excellent wetting and soldering performance at a significantly lower melting point than conventional SAC alloys, protecting thermal‑sensitive components while maintaining production efficiency. Whether you run a high‑volume line or a specialised assembly process, this SMT solder paste provides the thermal protection and process stability you require.
  • Soft Silicone Thermal Pad for CPU

    Soft Silicone Thermal Pad for CPU

    Typical applications of Soft Silicone Thermal Pad for CPU LED lighting, lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply
  • Inductor Thermal Potting

    Inductor Thermal Potting

    Features & Benefits of Inductor Thermal Potting TS8800 Two-component silicone potting, 1 to 1, curing at room temperature. REACH, ROHS, certified Good waterproof Good thermal conductivity Easy to mix and use
  • Customized CPU Heatsink Cooler Thermal Mat

    Customized CPU Heatsink Cooler Thermal Mat

    Customized CPU heatsink cooler thermal mat hot sale LED lighting, lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply
  • High Temperature SMT Lead Free Solder Paste Welding Material

    High Temperature SMT Lead Free Solder Paste Welding Material

    TS505 is a high‑temperature, no‑clean solder paste lead free based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy, with a melting range of 217–218°C. Engineered for demanding SMT applications, this solder paste lead free delivers outstanding print stability, excellent wetting on OSP and mildly oxidized pads, and exceptionally low voiding – critical for QFN, LGA, and large thermal‑pad components. Its halogen‑controlled flux (0.085%, L1 level) leaves a dry, non‑conductive residue that passes stringent SIR tests (≥1.0×10⁸Ω at 40°C/90% RH and ≥5.0×10⁸Ω at 80°C/85% RH), supporting no‑clean processes and reliable ICT probing. The wide reflow window (peak 240–250°C, with 60–90 seconds above liquidus) accommodates diverse PCB designs and reduces defects like bridging and tombstoning.
  • Electrical Adhesive Glue

    Electrical Adhesive Glue

    TENSAN Electrical Adhesive Glue TS6603 is semi-flow RTV silicone with good waterproof function and sealing strength. Electrical Adhesive Glue can be used for bonding metal, glass, ceramics etc. material.​ REACH, ROHS certified MSDS for air/sea shipment Fast curing Non-corrosive to most Copper, Polycarbonate plastics material Excellent waterproof function Excellent sealing performance Good Performance for insulation

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