TENSAN TS‑501 is a SnAgBi Alloy Solder Paste engineered specifically for SMT assembly processes that require lower reflow temperatures without compromising joint quality. Formulated with a Sn‑Ag1‑Bi35 alloy, this SnAgBi solder paste delivers a peak reflow temperature of 210–230°C – significantly lower than SAC305 – while providing excellent printability, strong wetting, and reliable electrical performance. With Type‑4 powder, ROL1 flux, and no‑clean residue, TS‑501 is the SnAgBi alloy solder paste that combines thermal protection with fine‑pitch capability and environmental responsibility.
SnAgBi Alloy Solder Paste – TENSAN TS-501 Mid-Temperature Solution
In the evolving landscape of lead‑free soldering, bismuth‑containing alloys have emerged as a compelling alternative to conventional SAC compositions. SnAgBi solder paste offers a unique combination of lower melting point, excellent wetting, and reliable mechanical properties – all while maintaining full RoHS compliance. Whether you are assembling heat‑sensitive LED modules, flexible circuits, or performing step‑soldering processes, the right SnAgBi alloy solder paste can significantly reduce thermal stress and improve production yields.
TENSAN TS‑501 is a SnAgBi Alloy Solder Paste engineered specifically for SMT assembly processes that require lower reflow temperatures without compromising joint quality. Formulated with a Sn‑Ag1‑Bi35 alloy, this SnAgBi solder paste delivers a peak reflow temperature of 210–230°C – significantly lower than SAC305 – while providing excellent printability, strong wetting, and reliable electrical performance. With Type‑4 powder, ROL1 flux, and no‑clean residue, TS‑501 is the SnAgBi alloy solder paste that combines thermal protection with fine‑pitch capability and environmental responsibility.
What Is TENSAN TS‑501 SnAgBi Alloy Solder Paste?
TS‑501 is a lead‑free, no‑clean SnAgBi solder paste designed for SMT assembly processes that require:
Lower reflow temperatures – Bismuth content (34.5–35.5%) reduces melting point to protect heat‑sensitive components
Full RoHS compliance – 100% lead‑free alloy, meeting global environmental standards
Excellent printability – Type 4 powder (20–38 μm) ensures consistent deposit volume and shape retention
No‑clean convenience – Clear, minimal residue that supports ICT testing without cleaning
Long stencil life – Stable rheology maintains print performance over extended production shifts
High reliability – Passes SIR and electromigration tests for long‑term electrical stability
As a SnAgBi alloy solder paste, TS‑501 is trusted by manufacturers across LED lighting, automotive electronics, consumer devices, and telecommunications for its consistent performance and thermal protection capabilities.
Key Specifications
Alloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Test methods conform to IPC J‑STD‑004, IPC J‑STD‑005, JIS Z 3284, and Bellcore GR78‑CORE standards.
Why Choose TENSAN TS‑501 as Your SnAgBi Alloy Solder Paste?
1. Unique Bi35 Composition – Lower Reflow Temperatures
TS‑501 uses a Sn‑Ag1‑Bi35 alloy that significantly reduces the melting point compared to standard SAC305. The peak reflow temperature of 210–230°C protects heat‑sensitive components such as LEDs, plastic connectors, and flexible substrates from thermal degradation. This makes this SnAgBi alloy solder paste the ideal choice for assemblies that cannot tolerate high temperatures, while still providing strong, reliable joints. As a SnAgBi solder paste, TS‑501 delivers the reliability of SAC alloys at a more forgiving temperature profile – a key advantage for modern electronics manufacturing.
2. Excellent Printability – Consistent Fine‑Pitch Performance
With Type 4 powder (20–38 μm), TS‑501 delivers:
Whether you use an automatic printer or manual equipment, this SnAgBi alloy solder paste adapts to your process requirements, ensuring high first‑pass yields.
3. No‑Clean, Low‑Residue – Saves Process Steps
The flux system leaves a clear, non‑conductive residue that:
This no‑clean design makes TS‑501 a highly efficient SnAgBi solder paste for high‑volume production.
4. Long Stencil Life and Stable Viscosity
TS‑501 maintains consistent viscosity for:
This stability ensures that your SnAgBi alloy solder paste printer operates at peak efficiency with minimal interruptions.
5. High Electrical Reliability – Essential for Long‑Term Performance
With SIR exceeding 1.7×10⁹ Ω (IPC) and 6.4×10¹² Ω (Bellcore), and passing 500‑hour electromigration testing, TS‑501 ensures that the residue left by this SnAgBi solder paste does not compromise long‑term reliability – even in humid environments. This makes it a trusted SnAgBi alloy solder paste for automotive, telecommunications, and industrial applications.
Recommended Application Parameters
Stencil Design Guidelines
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics. "Roof‑shaped" aperture designs help reduce solder balling between components.
Printing Conditions
Reflow Profile (Recommended)
The lower peak temperature of this SnAgBi alloy solder paste provides a protective thermal environment for heat‑sensitive components while still delivering strong, reliable solder joints. Adjust profiles based on your specific reflow oven and PCB assembly requirements.
Storage and Handling Guidelines for This SnAgBi Solder Paste
Important: Do not mix leftover paste with fresh paste in the same container. Always warm up this SnAgBi alloy solder paste in its sealed container to prevent moisture condensation, which can cause spattering during reflow.Alloy Composition Overview (SnAgBi Alloy)Important: Do not mix leftover paste with fresh paste in the same container. Always warm up this SnAgBi alloy solder paste in its sealed container to prevent moisture condensation, which can cause spattering during reflow.
Alloy Composition Overview
This SnAgBi solder paste composition ensures low melting point while maintaining good mechanical strength and wettability.
Typical Applications for This SnAgBi Alloy Solder Paste
TS‑501 is ideal for applications requiring lower reflow temperatures and full environmental compliance:
Telecommunications – RF modules, base station componentsAs a versatile SnAgBi alloy solder paste, TS‑501 is trusted by manufacturers across these diverse industries.
Quality Assurance
Every batch of TENSAN TS‑501 is accompanied by a Certificate of Analysis confirming:
Our manufacturing processes ensure consistent product quality from lot to lot, giving you confidence in every production run with this SnAgBi alloy solder paste.
Frequently Asked Questions
Q: What is the advantage of using a SnAgBi alloy solder paste?
A: SnAgBi solder paste like TS‑501 offers a significantly lower melting point than SAC305, protecting heat‑sensitive components while maintaining good wetting and joint strength. This makes it ideal for LEDs, flexible circuits, and step‑soldering applications.
Q: Is TS‑501 a lead‑free product?
A: Yes, TS‑501 is a 100% lead‑free SnAgBi alloy solder paste, fully compliant with RoHS and REACH requirements.
Q: Can this SnAgBi solder paste be used for fine‑pitch printing?
A: Absolutely. With Type‑4 powder (20–38 μm), TS‑501 supports fine‑pitch printing down to 0.25 mm, making it a versatile SnAgBi alloy solder paste for dense boards.
Q: Does TS‑501 require post‑reflow cleaning?
A: No. TS‑501 is a no‑clean SnAgBi solder paste. The residue is clear, non‑conductive, and compatible with ICT testing, eliminating cleaning steps.
Q: What is the shelf life of this SnAgBi alloy solder paste?
A: Six months from production date when stored at 5–10°C. At room temperature, it can be kept for up to 15 days.
Q: Can TS‑501 be used in nitrogen reflow?
A: Yes, it performs well in both air and nitrogen environments.
Conclusion
For manufacturers who demand lower processing temperatures without compromising solder joint quality, TENSAN TS‑501 is the definitive SnAgBi Alloy Solder Paste solution. This SnAgBi solder paste offers excellent printability, stable viscosity, no‑clean convenience, and proven electrical reliability – all in one cost‑effective formulation.
By choosing TS‑501, you select a SnAgBi alloy solder paste that:
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
