TENSAN TS‑501 is a SnAgBi Solder Paste engineered specifically for SMT assembly processes that require lower reflow temperatures without compromising solder joint quality. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste 501 product offers a significantly lower melting point than conventional SAC alloys, protecting heat‑sensitive components while maintaining production efficiency. With Type‑4 powder, ROL1 flux classification, and no‑clean residue, TS‑501 is the SnAgBi solder paste that combines environmental responsibility with outstanding process performance.
SnAgBi Solder Paste – TENSAN TS-501 Mid-Temperature Solution
In modern electronics manufacturing, the demand for SnAgBi solder paste has grown significantly as engineers seek alternatives that balance lower processing temperatures with reliable joint performance. The unique bismuth-containing alloy system offers a distinct advantage: it reduces reflow temperatures while maintaining the excellent wetting and mechanical properties expected from a high-quality solder paste 501 product. Whether you are assembling LED lighting modules, flexible PCBs, or performing step-soldering processes, TENSAN TS‑501 delivers the performance you need.
TENSAN TS‑501 is a SnAgBi Solder Paste engineered specifically for SMT assembly processes that require lower reflow temperatures without compromising solder joint quality. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste 501 product offers a significantly lower melting point than conventional SAC alloys, protecting heat‑sensitive components while maintaining production efficiency. With Type‑4 powder, ROL1 flux classification, and no‑clean residue, TS‑501 is the SnAgBi solder paste that combines environmental responsibility with outstanding process performance.
What Is TENSAN TS‑501 SnAgBi Solder Paste?
TS‑501 is a lead‑free, no‑clean SnAgBi solder paste designed for SMT assembly processes that require:
As a solder paste 501 product, TS‑501 is trusted by manufacturers across LED lighting, consumer electronics, automotive, and telecommunications industries for its consistent performance and thermal protection capabilities
Key Specifications
Alloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Why Choose TENSAN TS‑501 as Your SnAgBi Solder Paste?
1. Unique Bi35 Alloy – Lower Reflow Temperatures
TS‑501 uses a Sn‑Ag1‑Bi35 alloy that significantly reduces the melting point compared to standard SAC305. The peak reflow temperature of 210–230°C protects heat‑sensitive components such as LEDs, plastic connectors, and flexible substrates from thermal degradation. This makes this SnAgBi solder paste the ideal choice for assemblies that cannot tolerate high temperatures, while still providing strong, reliable joints. As a solder paste 501 product, TS‑501 delivers the reliability of SAC alloys at a more forgiving temperature profile.
2. Excellent Printability – Consistent Fine‑Pitch Performance
With Type 4 powder (20–38 μm), TS‑501 delivers:
Whether you use an automatic printer or manual equipment, this SnAgBi solder paste adapts to your process requirements, ensuring high first‑pass yields.
3. No‑Clean, Low‑Residue – Saves Process Steps
The flux system leaves a clear, non‑conductive residue that:
This no‑clean design makes TS‑501 a highly efficient solder paste 501 product for high‑volume production.
4. Long Stencil Life and Stable Viscosity
TS‑501 maintains consistent viscosity for:
This stability ensures that your SnAgBi solder paste printer operates at peak efficiency with minimal interruptions.
5. High Electrical Reliability – Essential for Long‑Term Performance
With SIR exceeding 1.7×10⁹ Ω (IPC) and 6.4×10¹² Ω (Bellcore), and passing 500‑hour electromigration testing, TS‑501 ensures that the residue left by this solder paste 501 product does not compromise long‑term reliability – even in humid environments. This makes it a trusted SnAgBi solder paste for automotive, telecommunications, and industrial applications.
Recommended Application Parameters
Stencil Design Guidelines
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics. "Roof‑shaped" aperture designs help reduce solder balling between components.
Printing Conditions
Reflow Profile (Recommended)
The lower peak temperature of this SnAgBi solder paste provides a protective thermal environment for heat‑sensitive components while still delivering strong, reliable solder joints. Adjust profiles based on your specific reflow oven and PCB assembly requirements.
Storage and Handling Guidelines for This Solder Paste 501 Product
Important: Do not mix leftover paste with fresh paste in the same container. Always warm up this SnAgBi solder paste in its sealed container to prevent moisture condensation, which can cause spattering during reflow.
Alloy Composition Overview (SnAgBi)
Lead content is strictly controlled below 0.04%, ensuring full RoHS compliance for this solder paste 501 product.
Typical Applications for This SnAgBi Solder Paste
TS‑501 is ideal for applications requiring lower reflow temperatures and full environmental compliance:
As a versatile SnAgBi solder paste, TS‑501 is trusted by manufacturers across these diverse industries.
Quality Assurance
Every batch of TENSAN TS‑501 is accompanied by a Certificate of Analysis confirming:
Our manufacturing processes ensure consistent product quality from lot to lot, giving you confidence in every production run with this solder paste 501 product.
Frequently Asked Questions
Q: What makes TS‑501 a SnAgBi solder paste?
A: TS‑501 uses a Sn‑Ag1‑Bi35 alloy, which is a bismuth‑containing SnAgBi solder paste formulation. The bismuth content (34.5–35.5%) significantly lowers the melting point compared to standard SAC alloys, making it ideal for heat‑sensitive applications.
Q: How does this solder paste 501 product differ from SAC305?
A: As a solder paste 501 product, TS‑501 contains 35% bismuth, which lowers the melting point significantly compared to SAC305. This makes it a superior choice for heat‑sensitive components and step‑soldering processes.
Q: Is TS‑501 compatible with standard SMT equipment?
A: Yes. This SnAgBi solder paste works with all standard automatic and semi‑automatic printers, as well as standard reflow ovens. Its Type‑4 powder supports fine‑pitch printing down to 0.25 mm.
Q: Does TS‑501 require post‑reflow cleaning?
A: No. TS‑501 is a no‑clean solder paste 501 product. The residue is clear, non‑conductive, and compatible with ICT testing, eliminating cleaning steps and reducing costs.
Q: What is the shelf life of this SnAgBi solder paste?
A: Six months from production date when stored at 5–10°C. At room temperature, it can be kept for up to 15 days.
Q: Can TS‑501 be used for nitrogen reflow?
A: Yes, it performs well in both air and nitrogen reflow environments.
Q: What industries commonly use this solder paste 501 product?
A: TS‑501 is widely used in LED lighting, consumer electronics, automotive, flexible PCB, and telecommunications manufacturing – anywhere that lower reflow temperatures and reliable SnAgBi performance are required.
Conclusion
For manufacturers who demand lower processing temperatures without compromising solder joint quality, TENSAN TS‑501 is the definitive SnAgBi solder paste solution. This solder paste 501 product offers excellent printability, stable viscosity, no‑clean convenience, and proven electrical reliability – all in one cost‑effective formulation.
By choosing TS‑501, you select a SnAgBi Solder Paste that:
Meets full RoHS compliance as a lead‑free productUpgrade to TENSAN TS‑501 – the SnAgBi solder paste that combines performance, protection, and reliability.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
