TS505 is a high‑temperature, lead‑free, no‑clean solder paste formulated with the Sn99Ag0.3Cu0.7 (SAC0307) alloy and utilising solder paste type 4 powder (20–38 μm) as the standard particle size. This solder paste type 4 is engineered to deliver excellent print stability, superior wetting, and low voiding across a wide range of SMT applications – from fine‑pitch consumer devices (down to 0.4 mm) to large‑format telecom and automotive boards. Key advantages include a wide reflow window (peak 240–250°C, with 60–90 seconds above liquidus), minimal non‑conductive residue (~0.085% halogen, L1 level), and high SIR values (≥1.0×10⁸Ω at 40°C/90% RH and ≥5.0×10⁸Ω at 80°C/85% RH). The Type 4 powder ensures consistent aperture release, extended stencil life, and reduced cleaning frequency. TS505 supports both air and nitrogen reflow and is fully RoHS compliant.
In modern surface‑mount assembly, the choice of powder size is as critical as the alloy composition itself. Among the various classifications, solder paste type 4 has become the de facto standard for high‑density applications, offering the ideal balance between print resolution and oxidation resistance. With particle sizes ranging from 20 to 38 micrometres, solder paste type 4 delivers the fine‑feature definition needed for 0.4 mm pitch components and below, while maintaining sufficient volume for reliable joint formation.
TS505 is a high‑temperature, lead‑free, no‑clean solder paste formulated with Sn99Ag0.3Cu0.7 (SAC0307) alloy and utilising solder paste type 4 powder as its standard offering. This solder paste type 4 product is engineered to provide exceptional print stability, excellent wetting, and low voiding across a wide spectrum of SMT applications – from telecom infrastructure and automotive electronics to consumer wearables. For even finer pitch requirements, solder paste type 4 can be upgraded to Type 5 upon request, but for most production environments, Type 4 delivers the optimal combination of performance and cost‑effectiveness.
Why Solder Paste Type 4 Matters for Modern Assembly？
The classification solder paste type 4 is defined by IPC standards, with a particle size distribution that ensures consistent flow through stencil apertures. Smaller particles allow for finer pitch printing, but they also increase surface area, which can accelerate oxidation and reduce stencil life. Solder paste type 4 strikes the right balance – it is fine enough to print 0.4 mm pitch pads without clogging, yet coarse enough to maintain robust flux activity and low voiding.
TS505 takes full advantage of solder paste type 4 by pairing it with a carefully balanced flux system that protects the powder from premature oxidation. This solder paste type 4 formulation ensures that each particle contributes to a homogeneous paste that releases cleanly from the stencil, holds its shape after printing, and coalesces smoothly during reflow. The result is consistent, high‑quality solder joints that meet the reliability demands of today's electronics.
Product Specifications
Alloy Composition
Alloy Physical Properties
Solder Paste Specification
Core Advantages of This Solder Paste Type 4
1. Wide Reflow Process Window – Flexibility Across Board Types
TS505, with its solder paste type 4 powder, offers a generous reflow window that accommodates boards of varying thermal masses and densities. The recommended reflow profile is as follows:
This solder paste type 4 supports both air and nitrogen reflow, enabling consistent wetting and low voiding across different oven types. The wide process window helps minimise defects such as solder beads, bridging, and tombstoning, ensuring high first‑pass yields.
2. Excellent Wettability and Solder Wicking
The flux system in TS505 is optimised for solder paste type 4, ensuring rapid oxide removal and superior wetting on all common surface finishes – including ENIG, OSP, HASL, and immersion silver. This solder paste type 4 produces bright, full fillets with strong capillary climb, resulting in consistent intermetallic formation and robust joint strength.
3. Low Voiding – Critical for Power and Thermal Components
Voiding is a major concern for QFN, LGA, and large thermal‑pad components. TS505's flux chemistry promotes efficient gas escape during reflow, significantly reducing void fractions. This solder paste type 4 has been validated in automotive and telecom applications where voiding below 25% is mandatory, ensuring optimal thermal and electrical performance.
4. Outstanding Printability and Stencil Life
TS505 exhibits excellent rollability and thixotropic recovery, ensuring consistent paste transfer on automated printers. The solder paste type 4 particles are sized to release cleanly from apertures, even on 0.4 mm pitch stencils. This solder paste type 4 maintains stable viscosity throughout extended production runs, reducing the need for frequent parameter adjustments. The paste resists drying in apertures, extending stencil cleaning intervals and maximising uptime.
5. Minimal Residue and High Insulation Resistance
After reflow, TS505 leaves a dry, translucent residue that is non‑conductive and probe‑friendly – a key advantage for no‑clean processes. This solder paste type 4 passes all relevant SIR tests:
These properties make TS505 a solder paste type 4 that supports reliable ICT probing without cleaning, reducing process steps and associated costs while ensuring long‑term electrical reliability.
Typical Applications for This Solder Paste Type 4
TS505 is a versatile solder paste type 4 that excels in:Telecom Base Stations & Server Motherboards – Large‑format PCBs requiring low voiding and high thermal cycling resistance.Automotive Electronics (ECU, BMS) – Demanding harsh‑environment applications where joint integrity is mission‑critical.Industrial Controls & Power Modules – High‑power assemblies where insulation resistance and joint strength are paramount.Consumer Electronics (TWS earbuds, smart wearables) – Fine‑pitch devices requiring precise printing; solder paste type 4 is standard, with Type 5 available for even finer pitches.
Frequently Asked Questions
Q: Why is solder paste type 4 the preferred choice for most SMT lines?
A: Solder paste type 4 offers the best balance between fine‑pitch printability and resistance to oxidation, making it suitable for 0.4 mm pitch components and below, while maintaining good stencil life and low voiding.
Q: Can TS505's solder paste type 4 be used for ultra‑fine pitch below 0.4 mm?
A: Yes, for pitches below 0.4 mm, we recommend upgrading to Type 5 powder. However, for most applications, solder paste type 4 provides excellent performance.
Q: What stencil thickness works best with this solder paste type 4?
A: Typically, stencil thicknesses of 100–150 µm are used with solder paste type 4, depending on the component pitch and required solder volume.
Q: Does TS505's solder paste type 4 support paste‑in‑hole (PiH) processes?
A: Yes, its stable rheology and flux activity make TS505 suitable for PiH applications, even with the fine particle size of solder paste type 4.
Q: How long can this solder paste type 4 remain on the stencil?
A: Under standard shop‑floor conditions (20–25°C, RH <65%), TS505 maintains its print performance throughout a typical shift, reducing downtime and improving productivity.
Package and Shipping
Each 500g bottle of this solder paste type 4 is packed in wide‑mouth plastic (PE) containers with an inner seal to preserve freshness. Bottles are shipped in foam‑lined boxes, with a maximum of 20 bottles per box, ensuring internal temperatures remain below 35°C during transit.Quality Assurance – Consistency You Can Rely OnEvery batch of TS505 is subjected to rigorous quality control, with a Certificate of Analysis provided to verify:Alloy composition (by ICP or XRF)Powder size distribution – confirming solder paste type 4 specificationsFlux content and activityViscosity at 25°CHalogen content (L1 level compliance)Our quality system ensures that every shipment of this solder paste type 4 delivers identical performance, giving you the confidence to run high‑volume production without unexpected process variation.ConclusionSelecting the right solder paste type 4 is a strategic decision that influences every stage of SMT assembly – from printing to reflow to final test. TS505 offers a proven combination of wide process window, excellent wetting, low voiding, minimal residue, and outstanding printability, all built around the industry‑standard solder paste type 4 powder. This solder paste type 4 formulation bridges the gap between stringent environmental mandates and the demanding performance requirements of modern electronics.
By choosing TS505, manufacturers can achieve:Higher first‑pass yieldsLower rework and repair costsReduced production downtimeConsistent, reliable solder joints across diverse applicationsFor those seeking a robust, high‑quality solder paste type 4 that performs reliably in both standard and challenging environments, TS505 is the trusted solution.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
For inquiries about alternative alloys, custom powder sizes, or specific formulations of solder paste type 4, please contact your local Tensan sales representative.
