TS-350 is a SAC305 (Sn96.5Ag3Cu0.5) lead-free, no-clean solder paste with a melting point of 221–227°C, Type 4 powder size (20–38 μm), flux content of 10.5±0.5%, and viscosity of 220,000 mPa·s. Key Advantages: Based on the industry-standard SAC305 alloy—offering excellent mechanical strength, thermal fatigue resistance, and reliable wetting. Stable printing, superb shape retention, low voiding, minimal residue (~5%), supports ultra-fine pitch down to 0.28mm, effective HiP resistance, and RoHS compliant.
The TS350 Advantage
In the evolving landscape of electronics assembly, TS350 (Sn96.5Ag3Cu0.5) has emerged as the industry's gold standard for lead-free solder alloys, offering an exceptional balance of melting temperature, mechanical strength, and thermal fatigue resistance. As a solder paste 305 product, TS-350 leverages this proven alloy system to deliver the reliability and process stability that modern SMT production demands.
In today's fast-paced manufacturing environment, production engineers face relentless pressure to boost throughput while driving down defect rates. As PCB layouts become increasingly dense and component packages continue to shrink, the solder paste 305 formulation you select directly influences your production efficiency, solder joint reliability, and overall operational costs.
High-performance solder paste featuring outstanding printability and superior wetting performance is precisely what TS-350 delivers—a no-clean solder paste built around the trusted SAC305 alloy, engineered specifically for manufacturers who refuse to compromise on soldering quality or environmental compliance. This solder paste 305 solution combines the proven metallurgy of Sn96.5Ag3Cu0.5 with advanced flux chemistry to achieve wetting characteristics that rival traditional tin-lead formulations.
Whether you're operating a high-volume production line or managing specialized rework stations, TS-350 delivers the stability, consistency, and wetting dynamics that today's demanding SMT applications require. This solder paste 305 formulation ensures robust joint formation across a wide range of surface finishes, including OSP, ENIG, and immersion silver—making it a versatile choice for diverse production environments.
What Makes TS-350 a High-performance solder paste featuring outstanding printability and superior wetting performance?
TS-350 is a widely adopted no-clean solder paste that bridges the gap between legacy tin-lead processes and modern lead-free assembly. As a solder paste 305 product, its SAC305 alloy composition provides a well-defined melting window of 221–227°C, enabling consistent reflow performance while delivering the mechanical strength and thermal cycling reliability required for mission-critical electronics.
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 combines the metallurgical benefits of the SAC305 alloy with advanced rheology and robust flux activation. This solder paste 305 formulation is specifically optimized to overcome the inherent wetting challenges of lead-free alloys, ensuring that your transition to lead-free does not come at the expense of soldering quality or production yield.
Product Specifications
Alloy Composition
Physical & Electrical Properties
Core Features and Benefits
1. Outstanding Print Performance
TS-350 delivers High-performance solder paste featuring outstanding printability and superior wetting performance consistently across extended production runs, as a solder paste 305 formulation that maintains excellent rheological stability throughout the printing cycle.
2. Superior Wetting and Soldering Quality
The SAC305 alloy in TS-350 delivers wetting performance that meets the highest industry standards. Wetting dynamics directly impact joint reliability, and this solder paste 305 formulation ensures rapid, complete wetting on all common PCB surface finishes.
3. Minimal Residue and Clean Solder Joints
4. Excellent Head-in-Pillow (HiP) Resistance
QFN and BGA packages are particularly vulnerable to head-in-pillow defects. This solder paste 305 formulation is specifically engineered to resist this common failure mode, improving first-pass yields and reducing costly rework.
5. RoHS Compliance
As a fully compliant solder paste 305 product, TS-350 meets all requirements of RoHS Directive 2002/95/EC, ensuring unhindered access to global electronics markets.
Storage and Handling Guidelines
Storage Conditions
Handling Procedure
Important: Always warm up sealed containers before opening to prevent moisture condensation on the paste surface. Condensation introduces moisture that can lead to spattering and excessive void formation during reflow.
Safety Considerations
Quality Assurance
Each production batch of TS-350 is accompanied by a comprehensive Certificate of Analysis (CoA) covering:
Every batch of this solder paste 305 product undergoes stringent quality testing to ensure that the SAC305 alloy composition remains within the tight tolerances required for consistent reflow performance. This commitment to quality gives you the confidence to run TS-350 across multiple production lines with predictable, repeatable results.
Typical Applications
TS-350 is designed to meet the demands of diverse electronics assembly sectors:
As a versatile solder paste 305 solution, TS-350 is equally at home in high-reliability automotive applications and cost-sensitive consumer electronics—demonstrating the broad appeal and adaptability of the SAC305 alloy system.
Frequently Asked Questions
Q: What makes SAC305 the preferred alloy for solder paste 305 products like TS-350?
A: SAC305 (Sn96.5Ag3Cu0.5) offers the best combination of melting temperature, mechanical strength, and thermal fatigue resistance among lead-free alloys. Its well-defined 221–227°C melting window enables consistent reflow profiles, while the silver content provides excellent wetting and joint strength. This makes it the most widely adopted solder paste 305 alloy in the industry—trusted by manufacturers worldwide.
Q: Can TS-350 be used for both standard-pitch and ultra-fine-pitch printing?
A: Yes. High-performance solder paste featuring outstanding printability and superior wetting performance is formulated to perform equally well on standard 0.5 mm pitch and ultra-fine 0.25 mm (10 mil) pitch applications. The SAC305 alloy's consistent particle size distribution, combined with advanced flux chemistry, ensures that this solder paste 305 formulation delivers reliable performance across the full pitch spectrum.
Q: What stencil type is recommended for TS-350?
A: High-quality laser-cut stainless steel stencils—such as ALPHA® Stencils or equivalent—are recommended to achieve optimal paste release and shape retention, particularly when printing fine-pitch patterns.
Q: Does TS-350 support paste-in-hole (PiH) applications?
A: Yes, TS-350 is suitable for paste-in-hole processes. The SAC305 alloy's wetting characteristics ensure that the paste flows readily into plated through-holes, forming reliable solder fillets on both sides of the board.
Q: How long can TS-350 remain on the stencil during production?
A: With its stable viscosity and extended stencil life, TS-350 maintains print performance throughout typical production shifts. Always reseal unused paste immediately after each use to maximize its operational lifespan.
Q: Is TS-350 compatible with both air and nitrogen reflow?
A: Yes. As a solder paste 305 solution, TS-350 performs well in both air and nitrogen reflow environments. Nitrogen reflow is recommended for applications requiring maximum wetting and minimal oxidation, particularly when soldering to OSP or immersion silver finishes.
Conclusion
Selecting the right solder paste alloy is one of the most consequential decisions in SMT assembly. For manufacturers seeking a proven, high-reliability solder paste 305 solution, TS-350 delivers the trusted performance of the SAC305 alloy combined with advanced printability and wetting characteristics. This powerful combination ensures consistent printing, superior joint quality, minimal residue, and field-proven reliability across the widest range of applications.
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 empowers manufacturers to achieve:
For manufacturers seeking a stable, high-quality solder paste 305 solution that bridges the gap between legacy tin-lead processes and today's demanding lead-free requirements, TS-350 is the proven industry choice. Our application engineering team is available to assist with reflow profile optimization, stencil design guidance, and process troubleshooting to ensure that your deployment of this solder paste 305 product is both seamless and successful.
Contact InformationTENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84-222-650-8818
Email: mark@sztensan.com
For inquiries regarding alternative alloys, custom packaging, or solder paste 305 reflow profile optimization and process support, please contact your local Tensan sales office.
