TENSAN TS‑501 is a mid‑temperature, no‑clean solder paste that is specifically formulated to perform optimally when processed through any solder paste mixer. Its Sn‑Ag1‑Bi35 alloy, Type‑4 powder, and advanced flux chemistry ensure that after just 1–3 minutes in a Solder Paste Mixer, the paste is perfectly homogenised, ready for fine‑pitch printing on your Automatic Solder Paste Printer – all while protecting heat‑sensitive components with its lower reflow temperature
Solder Paste Mixer – TENSAN TS-501 Mid-Temperature Solder Paste
In any SMT assembly line, the solder paste mixer plays a critical role in ensuring that the paste reaches its optimal consistency before printing. Proper mixing restores homogeneity after cold storage, redistributes flux and alloy particles evenly, and guarantees consistent printing performance. Whether you use a manual or an automatic Solder Paste Mixer, the paste itself must respond well to the mixing process – delivering stable viscosity, excellent printability, and reliable soldering results.
TENSAN TS‑501 is a mid‑temperature, no‑clean solder paste that is specifically formulated to perform optimally when processed through any solder paste mixer. Its Sn‑Ag1‑Bi35 alloy, Type‑4 powder, and advanced flux chemistry ensure that after just 1–3 minutes in a Solder Paste Mixer, the paste is perfectly homogenised, ready for fine‑pitch printing on your Automatic Solder Paste Printer – all while protecting heat‑sensitive components with its lower reflow temperature.
What Is TENSAN TS‑501 for Solder Paste Mixer?
TS‑501 is a lead‑free, no‑clean solder paste designed for SMT processes that demand:
Whether you use a planetary, centrifugal, or manual solder paste mixer, TS‑501 provides the rheological stability needed for high‑yield SMT assembly.
Key Specifications
Alloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Test methods conform to IPC J‑STD‑004, IPC J‑STD‑005, JIS Z 3284, and Bellcore GR78‑CORE standards.
Why Choose TENSAN TS‑501 for Your Solder Paste Mixer?
1. Fast and Effective Homogenisation
After prolonged cold storage (5–10°C), solder paste components can separate slightly – flux may rise to the top, and powder may settle. TS‑501 is formulated to re‑homogenise quickly and uniformly when processed through a Solder Paste Mixer. With just 1–3 minutes in an automatic planetary or centrifugal solder paste mixer, the paste returns to its optimal consistency, ensuring that every print has the same flux‑to‑powder ratio. This rapid response to mixing reduces preparation time and maximises your solder paste mixer throughput.
2. Stable Viscosity After Mixing
Once mixed, TS‑501 maintains its viscosity within specification for more than 8 hours on the stencil. This stability means that you can prepare paste in your Solder Paste Mixer at the start of a shift and rely on consistent performance throughout the day – without viscosity drift or slump. This is a key advantage for high‑volume lines where the solder paste mixer is used for multiple batches.
3. Excellent Printability After Mixing
The rheology of TS‑501 is optimised for automated printing: it shear‑thins under squeegee pressure for easy aperture filling, then quickly recovers to hold its shape after release. This behaviour is fully preserved after mixing in any Solder Paste Mixer, delivering sharp deposits with minimal slump – even on ultra‑fine 0.25 mm pitch pads.
4. No‑Clean, Low‑Residue – Saves Cleaning StepsAfter reflow, TS‑501 leaves a clear, dry residue that is non‑conductive and fully compatible with ICT. This eliminates post‑reflow cleaning, saving chemicals and cycle time. The consistency of this residue is ensured by proper mixing in your Solder Paste Mixer, which guarantees uniform flux distribution.
5. Lower Reflow Temperature – Protects Components
The Sn‑Ag1‑Bi35 alloy reduces the peak reflow temperature to 210–230°C, significantly lower than SAC305. This protects heat‑sensitive components – such as LEDs, plastic connectors, and flexible substrates – while still forming strong, reliable joints. And because the paste homogenises perfectly in your Solder Paste Mixer, you get consistent alloy distribution and uniform melting behaviour.
Recommended Mixing and Application Parameters
Stencil Design Guidelines
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics. "Roof‑shaped" aperture designs help reduce solder balling.
Printing Conditions
Reflow Profile (Recommended)
The lower peak temperature protects heat‑sensitive components while still forming strong joints. Adjust based on your specific oven and board design.
Storage, Handling, and Mixing Guidelines with Your Solder Paste Mixer
Important: Always warm up TS‑501 in its sealed container to prevent moisture condensation. After warming, process the paste in your Solder Paste Mixer according to the recommended time. Do not mix leftover paste with fresh paste in the same container. Proper mixing in a solder paste mixer is essential to restore the paste’s original performance characteristics after cold storage.
Alloy Composition Overview
Typical Applications for This Solder Paste Mixer-Compatible Product
TS‑501 is used in industries where lower reflow temperatures and consistent mixing are essential:
In every application, proper use of a Solder Paste Mixer with TS‑501 ensures consistent paste properties and reliable soldering.
Quality Assurance
Every batch of TENSAN TS‑501 is accompanied by a Certificate of Analysis confirming:
Our stringent QC ensures that each shipment delivers the same high performance – and that the paste responds predictably to your Solder Paste Mixer operations.
Frequently Asked Questions
Q: Why is mixing important for solder paste?
A: Cold storage can cause separation of flux and powder. Using a Solder Paste Mixer restores homogeneity, ensuring consistent flux distribution, stable viscosity, and repeatable printing performance. TS‑501 is specifically designed to respond quickly and uniformly to any solder paste mixer.
Q: What type of solder paste mixer is recommended for TS‑501?
A: A planetary or centrifugal Solder Paste Mixer is ideal, with 1–3 minutes of mixing time. Manual mixing (3–6 minutes) is also acceptable. Always follow the manufacturer’s instructions for your specific solder paste mixer.
Q: How long can TS‑501 stay on the stencil after mixing?
A: Over 8 hours under normal conditions (22°C, 50% RH), provided the paste was properly homogenised in your Solder Paste Mixer before use.
Q: Can I use TS‑501 directly from the refrigerator without a solder paste mixer?
A: No. After cold storage, you must warm up the paste (4 hours sealed at room temperature) and then mix it thoroughly using a Solder Paste Mixer or manually. Without proper mixing, flux separation can cause inconsistent printing and soldering defects.
Q: Is TS‑501 compatible with automatic solder paste printers?
A: Yes. After mixing in your Solder Paste Mixer, TS‑501 performs excellently on all standard automatic printers, delivering sharp, consistent deposits for fine‑pitch applications.
Q: What is the shelf life of TS‑501?
A: Six months from production date when stored at 5–10°C.
Q: Does TS‑501 require special handling after mixing?
A: Keep the paste sealed when not in use. If printing is interrupted, cover the stencil to prevent drying. Always reseal the jar immediately after dispensing paste for your next batch.
Conclusion
For manufacturers who rely on consistent, high‑quality SMT assembly, the combination of a reliable Solder Paste Mixer and a compatible solder paste is essential. TENSAN TS‑501 is formulated to perform perfectly with any solder paste mixer – delivering fast homogenisation, stable viscosity, excellent printability, and reliable soldering at lower reflow temperatures. By integrating TS‑501 into your process, you reduce defects, protect heat‑sensitive components, and maximise the efficiency of your Solder Paste Mixer and printing equipment.
Choose TENSAN TS‑501 – the solder paste that makes every Solder Paste Mixer work better.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
