TS‑350 is a lead‑free, no‑clean solder paste built around a high‑performance solder flux that ensures outstanding printability and superior wetting. The flux chemistry delivers stable rheology for fine‑pitch printing (down to 0.25 mm / 10 mil), rapid oxide removal, and excellent wetting on all common surface finishes. It leaves a dry, non‑conductive residue (~5 % w/w) that passes SIR tests and supports in‑circuit testing without cleaning.
How an Advanced Solder Flux Elevates SMT Printing and Wetting Performance
In modern electronics assembly, every production manager knows the pain points: inconsistent print deposits, unpredictable solder balling, and stubborn defects that eat into first‑pass yields. As pad pitches shrink and component densities rise, the performance of your solder flux becomes the decisive factor – it directly influences how well the paste releases from the stencil, how effectively it wets the terminations, and how reliably the final joints perform under thermal and electrical stress.
TS‑350 is a lead‑free, no‑clean solder paste built around a specially engineered solder flux system. This solder flux is the key to achieving both ultra‑fine pitch printing (down to 0.25 mm / 10 mil) and robust soldering quality, without trade‑offs. Whether you operate high‑volume lines or handle specialised rework, the stability and wetting power provided by this solder flux ensure consistent results shift after shift.
What Makes This Solder Flux So Effective?
A superior solder flux must perform multiple roles simultaneously: remove oxides, protect the metal surface during reflow, promote wetting, and leave a benign residue. TS‑350’s solder flux is balanced to deliver all these functions, bridging the gap between legacy SnPb processes and today’s lead‑free requirements. Its rheology – carefully tuned by the flux chemistry – ensures stable printing over extended runs, while its activation profile guarantees rapid wetting on various board finishes.
This solder flux formulation combines advanced rheological control with robust activation, making TS‑350 suitable for standard SMT assemblies as well as demanding applications like QFN, BGA, and ultra‑fine pitch pads down to 11 mil (0.28 mm) square.
Alloy Composition
Physical & Electrical Properties
Core Benefits Driven by the Solder Flux
1. Outstanding Print Performance – Thanks to the Flux Rheology
The solder flux in TS‑350 is designed to maintain stable viscosity throughout continuous printing. This means:
2. Superior Wetting – The True Test of a Solder Flux
Wetting performance is where the solder flux truly shines. TS‑350’s flux chemistry activates at the right temperature, removing oxides rapidly and promoting strong capillary action.
3. Minimal, Non‑Conductive Residue – A Clean Flux Signature
After reflow, the solder flux leaves only about 5% (w/w) of dry, translucent residue. This residue:
4. Excellent Head‑in‑Pillow (HiP) Resistance
HiP defects are a known challenge with BGA and QFN assemblies. The solder flux in TS‑350 is specifically formulated to delay oxide re‑formation during the soak phase, ensuring that the molten paste and component ball fuse completely. This reduces HiP‑related failures and improves in‑line test yields.
5. RoHS Compliance
TS‑350 meets all requirements of RoHS Directive 2002/95/EC, and the solder flux is halogen‑free at L0 level (0.085% halogens), ensuring regulatory compliance for global shipments.
Storage and Handling – Protecting Your Solder Flux
To maintain the activity and rheology of the solder flux, follow these guidelines:
Storage Conditions
Handling Procedure
Critical: Always warm up sealed containers before opening. Condensation introduces moisture that can degrade the solder flux, causing spattering and voiding during reflow.
Recommended Reflow Profile
Quality Assurance – Consistency in Flux Performance
Every batch of TS‑350 is accompanied by a Certificate of Analysis (CoA) that verifies:
Our quality system ensures that the solder flux chemistry is identical from lot to lot, giving you confidence in reproducible process outcomes.
Typical Applications
TS‑350, with its advanced solder flux, is ideal for:
Frequently Asked Questions
Q: Does the solder flux in TS‑350 work well for both standard and fine‑pitch printing?
A: Absolutely. The solder flux is engineered to provide stable rheology and consistent wetting across pitches from 0.5 mm down to 0.25 mm (10 mil).
Q: What stencil is recommended to get the best from this solder flux?
A: Laser‑cut, electro‑polished stainless steel stencils (e.g., ALPHA® Stencils) provide the best release, thanks to the flux’s optimal shear‑thinning behaviour.
Q: Can TS‑350 be used for paste‑in‑hole (PiH) applications?
A: Yes. The solder flux has sufficient tack and activity to support PiH processes.
Q: How long can the paste remain on the stencil without the flux degrading?
A: Under typical conditions, TS‑350 maintains its print performance for a full shift. Always reseal unused paste to preserve the solder flux activity.
Conclusion
Choosing a solder paste is really choosing its solder flux – because the flux dictates printability, wetting, residue behaviour, and reliability. TS‑350 delivers a proven solder flux system that ensures:
For manufacturers who need a stable, high‑quality lead‑free solution that bridges legacy and advanced processes, TS‑350 – with its exceptional solder flux – is the trusted choice.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
For enquiries about alternative alloys, custom flux formulations, or special packaging, please contact your local Tensan sales representative.
