TENSAN TS‑503 is a No-Clean Solder Paste engineered specifically to excel on any solder paste printer. With its unique Sn‑Ag0.3‑Bi35 alloy, Type‑4 powder (20–38 μm), and optimised rheology, TS‑503 delivers exceptional print stability, long stencil life (>8 hours), and consistent transfer efficiency – making it the ideal solder paste for high‑volume, medium‑temperature SMT production. Whether you operate a fully automatic Stencil Printer for SMT or a semi‑automatic system, TS‑503 adapts to your process, ensuring sharp deposits, minimal slump, and reliable solder joints
In modern SMT assembly, the Stencil Printer for SMT is the single most critical piece of equipment determining production yield and quality. Studies show that up to 60% of solder defects originate during the printing process, making the selection of both the right solder paste printer and the right solder paste essential for achieving high first‑pass yields. The solder paste printer must deliver precise positioning, mechanical stability, and consistent set‑up – but even the best Stencil Printer for SMT cannot compensate for a poorly formulated solder paste.
TENSAN TS‑503 is a No-Clean Solder Paste engineered specifically to excel on any solder paste printer. With its unique Sn‑Ag0.3‑Bi35 alloy, Type‑4 powder (20–38 μm), and optimised rheology, TS‑503 delivers exceptional print stability, long stencil life (>8 hours), and consistent transfer efficiency – making it the ideal solder paste for high‑volume, medium‑temperature SMT production. Whether you operate a fully automatic Stencil Printer for SMT or a semi‑automatic system, TS‑503 adapts to your process, ensuring sharp deposits, minimal slump, and reliable solder joints.
What Is TENSAN TS-503 for Stencil Printer for SMT?
TENSAN TS‑503 is a lead‑free, no‑clean solder paste designed for SMT assembly processes that demand medium‑temperature reflow and superior print performance. This No-Clean Solder Paste is formulated with a Sn‑Ag0.3‑Bi35 alloy, offering:
As a No-Clean Solder Paste, TS‑503 is trusted by manufacturers across LED lighting, automotive electronics, consumer devices, and telecommunications – all of whom rely on their Stencil Printer for SMT to deliver consistent, high‑quality prints shift after shift.
Key Specifications
Alloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Why Choose TENSAN TS-503 for Your Stencil Printer for SMT?
1. Optimised Rheology for Consistent Printing
The solder paste printer relies on the paste's ability to flow under shear and recover quickly after printing. TS‑503 exhibits excellent shear‑thinning behaviour: it flows easily through stencil apertures under squeegee pressure, then rapidly recovers viscosity to hold its shape without slumping. This ensures sharp, well‑defined deposits even for fine‑pitch components (0.5 mm and below). The Type‑4 powder (20–38 μm) further enhances this performance, providing consistent volume transfer for apertures down to 0.20 mm.
2. Long Stencil Life – Maximises Solder Paste Printer Uptime
TS‑503 maintains consistent viscosity for over 8 hours on the stencil under normal production conditions (22–28°C, 30–60% RH). This means fewer cleaning stops, less paste waste, and higher overall equipment effectiveness (OEE) for your Stencil Printer for SMT. Operators can run full shifts without viscosity drift, directly improving throughput and reducing cost per assembly.
3. Excellent Fine‑Pitch Capability
With Type‑4 powder and carefully balanced flux chemistry, TS‑503 supports ultra‑fine pitch printing down to 0.25 mm (10 mil). The paste releases cleanly from aperture walls, reducing smearing and ensuring consistent deposit volumes across the entire panel. This makes it an ideal solder paste for high‑density boards with QFN, BGA, and 0.4 mm QFP components – all printed on your solder paste printer.
4. No‑Clean, Low‑Residue – Compatible with ICT
After reflow, the flux system leaves a clear, non‑conductive residue that does not interfere with ICT or functional testing. This eliminates post‑reflow cleaning, reducing chemical costs and cycle time – a significant advantage when running high‑volume production on your Stencil Printer for SMT.
5. Wide Process Window – Adapts to Your Solder Paste Printer
TS‑503 is forgiving across a wide range of printing parameters:Print speeds:
This flexibility ensures that even if your solder paste printer has slight variations, the paste maintains consistent output, reducing scrap and rework.
6. Lower Reflow Temperature – Protects Components
The Sn‑Ag0.3‑Bi35 alloy reduces the peak reflow temperature to 210–230°C, significantly lower than SAC305. This protects heat‑sensitive components – such as LEDs, plastic connectors, and flexible substrates – while still forming strong, reliable joints. The lower silver content (0.3–0.5%) also reduces material costs, making TS‑503 a cost‑effective solder paste for high‑volume production.
Recommended Application Parameters for Your Solder Paste Printer
Stencil Design Guidelines
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics. For fine‑pitch applications, fine‑grain laser‑cut steel stencils with ceramic nano‑coating are recommended. "Roof‑shaped" aperture designs help reduce solder balling between components.
Printing Conditions for Solder Paste Printer
Note: Squeegee speed should be set in conjunction with other parameters like squeegee pressure, paste chemistry, and stencil aperture size. Metal squeegees or polyurethane rubber squeegees (hardness 80–90 Shore) are recommended.
Reflow Profile (Recommended)
The lower peak temperature of this No-Clean Solder Paste provides a protective thermal environment for heat‑sensitive components while still delivering strong, reliable solder joints. Adjust profiles based on your specific reflow oven and PCB assembly requirements.
Storage and Handling Guidelines
Important: Always warm up this solder paste in its sealed container to prevent moisture condensation, which can cause spattering during reflow. Proper storage and handling are essential to maintain the print consistency your Stencil Printer for SMT depends on.
Alloy Composition Overview
Typical Applications for This Solder Paste Printer-Ready Product
TS‑503 is ideal for applications requiring medium‑temperature reflow and consistent print performance:
In every application, TS‑503 delivers the print consistency that your Stencil Printer for SMT needs to achieve high first‑pass yields.
Quality Assurance
Every batch of TENSAN TS‑503 is accompanied by a Certificate of Analysis confirming:
Our manufacturing processes ensure consistent solder paste quality from lot to lot, giving you confidence in every production run on your solder paste printer.
Frequently Asked Questions
Q: What makes TS‑503 suitable for my Stencil Printer for SMT?
A: TS‑503 is formulated with optimised rheology, Type‑4 powder, and stable viscosity that maintains print performance for over 8 hours. This ensures consistent transfer efficiency and minimal downtime on any Stencil Printer for SMT.
Q: What print speed should I use with TS‑503 on my solder paste printer?
A: TS‑503 performs well across a wide speed range of 25–100 mm/s. Start at 50 mm/s and adjust based on your specific solder paste printer and stencil design.
Q: How long can TS‑503 stay on the stencil of my solder paste printer?
A: Over 8 hours under normal conditions (22–28°C, 30–60% RH), reducing the need for frequent cleaning – a key advantage for any Stencil Printer for SMT line.
Q: Does TS‑503 require special stencil cleaning on the solder paste printer?
A: Standard under‑stencil cleaning with isopropyl alcohol (IPA) or standard cleaning solvents is sufficient. Follow your solder paste printer manufacturer's recommendations for cleaning frequency.
Q: Is TS‑503 compatible with fine‑pitch printing on my solder paste printer?
A: Yes. With Type‑4 powder (20–38 μm), TS‑503 supports fine‑pitch printing down to 0.25 mm, making it ideal for dense boards on any Stencil Printer for SMT.
Q: What is the shelf life of TS‑503?
A: Six months from production date when stored at 5–10°C. At room temperature, it can be kept for up to 15 days.
Conclusion
The performance of your Stencil Printer for SMT depends on the quality of the solder paste you use. TENSAN TS‑503 is engineered to deliver exceptional print stability, long stencil life, and consistent transfer efficiency – making it the ideal No-Clean Solder Paste for high‑volume, medium‑temperature SMT production.
By choosing TS‑503, you select a solder paste that:
Upgrade to TENSAN TS‑503 – the No-Clean Solder Paste that makes your Stencil Printer for SMT perform at its best.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
