TS‑350 is a lead‑free, no‑clean solder paste whose carefully balanced solder paste composition (SAC305 alloy, Type 4 powder, and a halogen‑free flux system) delivers outstanding printability and superior wetting. The composition ensures stable viscosity (220,000 ± 30,000 mPa·s) for fine‑pitch printing down to 0.25 mm, rapid oxide removal, and low voiding on QFN/BGA packages. It leaves a dry, non‑conductive residue (~5 % w/w) that passes SIR tests and supports ICT without cleaning.
How Solder Paste Composition Defines Printing Precision and Wetting Reliability
In the high‑stakes world of surface‑mount assembly, production teams constantly battle the same obstacles: inconsistent deposit volumes, solder balls, and yield‑killing defects. As component pitches narrow and board densities soar, the solder paste composition you select becomes the single most influential factor in your process capability. It governs not only how well the paste releases from the stencil, but also how effectively it wets the terminations and how cleanly it leaves the board after reflow.
TS‑350 is a lead‑free, no‑clean solder paste whose solder paste composition has been meticulously balanced to meet the demands of both ultra‑fine pitch printing (down to 0.25 mm / 10 mil) and high‑reliability soldering. This particular solder paste composition ensures stable rheology over long production runs, rapid wetting on diverse surface finishes, and residue that stays benign and testable – all without compromising environmental compliance.
What Makes This Solder Paste Composition Exceptional?
A superior solder paste composition must harmonise multiple interacting components: the alloy powder (size, shape, and distribution), the flux vehicle (activators, resins, and solvents), and the rheological modifiers that control viscosity and slump. TS‑350 achieves this harmony through a SAC305 alloy matrix, a Type 4 powder sizing, and a halogen‑free flux system that activates progressively during reflow. This solder paste composition bridges the gap between legacy SnPb processes and lead‑free requirements, delivering stable printing even on 0.28 mm (11 mil) square pads while providing the wetting force needed for robust intermetallic formation.
The flux portion of the solder paste composition is especially critical – it removes oxides, protects the molten metal, and promotes capillary flow, yet leaves only a dry, non‑conductive film after soldering. This balanced solder paste composition makes TS‑350 suitable for standard SMT components as well as challenging packages like QFN, BGA, and other fine‑pitch devices.
Product Specifications – The Numbers Behind the Composition
Alloy Composition
Physical & Electrical Properties
Core Advantages Rooted in the Solder Paste Composition
1. Print Stability – A Direct Result of Rheological Design
The solder paste composition of TS‑350 includes specially selected thixotropic agents that maintain viscosity within a tight window (220,000 ± 30,000 mPa·s) even after hours of continuous printing. This stability translates to:
2. Wetting Performance – Driven by Flux Chemistry
The flux portion of the solder paste composition is engineered to activate at the right temperature, removing oxides rapidly and promoting strong wetting on all common finishes (ENIG, OSP, HASL, etc.).
3. Clean Residue – A Signature of a Well‑Balanced Composition
After reflow, TS‑350 leaves only about 5% (w/w) of dry, translucent residue. This residue:
4. Head‑in‑Pillow (HiP) Mitigation
HiP defects are a known risk with BGAs and QFNs. The solder paste composition of TS‑350 includes flux chemistries that delay oxide re‑formation during the soak phase, allowing the molten paste and component ball to coalesce fully. This significantly reduces HiP failures and improves first‑pass yields.
5. RoHS Compliance – Built into the Composition
The solder paste composition is fully compliant with RoHS Directive 2002/95/EC, and the halogen content is controlled at L0 level (0.085%), ensuring regulatory acceptance for global shipments.
Storage and Handling – Preserving the Integrity of Your Solder Paste Composition
To maintain the performance of this solder paste composition, follow these guidelines:
Storage Conditions
Handling Procedure
Recommended Reflow Profile
Quality Assurance – Consistency in Every Batch
Every batch of TS‑350 is accompanied by a Certificate of Analysis (CoA) that verifies the solder paste composition:
Our quality system ensures that the solder paste composition is identical from lot to lot, giving you repeatable process performance.
Typical Applications
TS‑350, with its optimized solder paste composition, is ideal for:
Frequently Asked Questions
Q: Does the solder paste composition of TS‑350 support both standard and fine‑pitch printing?
A: Yes. The solder paste composition is engineered to deliver excellent print performance on pitches from 0.5 mm down to 0.25 mm (10 mil).
Q: What stencil is recommended for this solder paste composition?
A: Laser‑cut, electro‑polished stainless steel stencils (e.g., ALPHA® Stencils) provide the best release due to the composition’s shear‑thinning properties.
Q: Can this solder paste composition be used for paste‑in‑hole (PiH)?
A: Absolutely. Its stable rheology and flux activity support PiH applications effectively.
Q: How long does this solder paste composition hold up on the stencil?
A: Under typical conditions, TS‑350 maintains its print performance for a full shift. Always reseal unused paste to preserve the composition.
Conclusion
Choosing a solder paste is ultimately choosing its solder paste composition – because the composition dictates every aspect of performance: printability, wetting, residue, and reliability. TS‑350 delivers a proven solder paste composition that ensures:
For manufacturers who need a robust, lead‑free solution that bridges legacy and advanced processes, TS‑350 – with its exceptional solder paste composition – is the trusted choice.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
For enquiries about alternative alloys, custom flux formulations, or specific solder paste composition adjustments, please contact your local Tensan sales representative.
