TS505 is a high‑temperature, lead‑free solder paste based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy (melting point 217–218°C), engineered for high‑reliability SMT assembly. Its performance begins with proper paste preparation – a task that relies on a reliable solder paste mixer. After refrigerated storage, TS505 responds predictably to mixing (1–2 minutes in a planetary or centrifugal solder paste mixer), restoring uniform flux distribution and optimal viscosity for consistent printing.
In the fast-paced world of surface-mount technology, achieving consistent, repeatable results starts long before the first PCB enters the printer. One of the most overlooked yet critical steps in the process is proper paste preparation—a task that relies heavily on a reliable solder paste mixer. The way you condition your solder paste directly impacts print quality, deposit consistency, and ultimately, the reliability of every solder joint on your board.
TS505 is a high-temperature, lead-free solder paste engineered to deliver exceptional performance across a wide range of SMT applications. However, even the finest solder paste mixer requires the right material to work with—and TS505 is precisely that material. Formulated with the Sn99Ag0.3Cu0.7 (SAC0307) alloy system and a meticulously balanced flux chemistry, TS505 ensures that every revolution of your solder paste mixer translates into a homogeneous, rheologically optimized paste ready for high-yield production.
Why Proper Paste Mixing Matters
Before any solder paste can deliver its full potential, it must be properly conditioned. A solder paste mixer serves a critical function: it restores the paste to its optimal viscosity and dispersion after cold storage. During refrigerated storage, the flux vehicle and alloy powder can separate slightly due to density differences. A quality solder paste mixer recombines these components uniformly, ensuring that every gram of paste—whether from the top, middle, or bottom of the jar—exhibits identical rheological behavior.
TS505 is designed to respond predictably to the mechanical action of your solder paste mixer, whether you're using a planetary mixer, a centrifugal mixer, or manual stirring. Its thixotropic properties ensure rapid recovery to target viscosity after mixing, allowing your solder paste mixer to prepare batches quickly and consistently.
Product Specifications
Alloy Composition
Alloy Physical Properties
Solder Paste Specification
Reflow Profile
Core Advantages – From the Solder Paste Mixer to the Finished Joint
1. Excellent Printability – Starting with Proper Mixing
The solder paste mixer is the first step in unlocking TS505's printing capabilities. After thorough mixing (1–2 minutes in a mixer or careful manual stirring), TS505 exhibits:
2.Excellent Wettability and Solder Wicking
Thanks to its optimally activated flux system, TS505 demonstrates superior wetting and solder wicking performance during reflow. It forms full, bright solder joints even on OSP-coated or mildly oxidized pads—so the homogeneous paste from your solder paste mixer delivers consistent, reliable connections.
3. Low Voiding
The refined flux formulation effectively minimizes void formation during reflow—particularly critical for large thermal-mass components such as QFN, LGA, and thermal pads. This low voiding performance is enhanced when the paste is properly mixed, ensuring uniform flux distribution throughout the batch.
Solder Paste Mixing
After thawing, it is recommended to use a solder paste mixer or perform manual stirring for 1–2 minutes to ensure complete homogenization of powder and flux. This step restores the paste to its optimal rheology, ensuring:
Your solder paste mixer plays a vital role in this step—whether you're using a planetary mixer for large batches or a smaller mixer for prototype runs. TS505 responds consistently to both automated and manual mixing methods.
Typical Applications
TS505 is designed for high-reliability assemblies where consistent mixing and print performance are paramount:
Consumer Electronics (TWS earbuds, smart wearables) – Fine-pitch components; Type 4 powder available upon request
Frequently Asked Questions
Q: What type of solder paste mixer is recommended for TS505?
A: Both planetary and centrifugal solder paste mixers work well with TS505. The key is to ensure gentle but thorough mixing for 1–2 minutes without overheating the paste.
Q: How long should I run the solder paste mixer before using TS505?
A: One to two minutes is typically sufficient. Your solder paste mixer should return the paste to its target viscosity without introducing excessive air or heat.
Q: Can TS505 be used immediately after mixing in the solder paste mixer?
A: Yes, after mixing, TS505 is ready for immediate use on your printing line. The paste's thixotropic properties ensure rapid viscosity recovery.
Q: Is manual stirring acceptable without a solder paste mixer?
A: While a dedicated solder paste mixer is preferred for consistency, manual stirring for 1–2 minutes can suffice for smaller batches, provided care is taken to ensure uniform mixing.
Package & Shipping
Each bottle contains 500g of TS505, packed in wide-mouth plastic (PE) bottles with an inner seal. Bottles are shipped in foam-lined boxes, with a maximum of 20 bottles per box, maintaining internal temperatures below 35°C during transit.
Quality Assurance
Each batch of TS505 undergoes rigorous quality control testing to ensure consistent performance. Key parameters verified include:
Our quality system ensures that every batch delivers the same reliable performance—whether you're using a manual solder paste mixer or an automated system.
Conclusion
The solder paste mixer is an essential partner in achieving high-quality SMT assembly—but its effectiveness depends on the paste you put through it. TS505 is engineered to respond consistently to the mechanical action of any solder paste mixer, delivering:
For manufacturers who demand both productivity and quality, TS505 and a properly configured solder paste mixer form the foundation of a robust, high-yield SMT line.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
