Leaded Solder Paste

Product Details

I. Solder Paste Composition

The Solder Paste Composition of TS107E consists of Sn63/Pb37 alloy powder and Solder Flux. According to the technical datasheet, the Solder Paste Composition contains 63% Tin and 37% Lead, forming a eutectic alloy with a melting point of 183°C. The Solder Flux content of this Leaded Solder Paste is approximately 5% (by weight), utilizing an ROL0-grade activator system. The Solder Paste Composition design of this SnPb Solder Paste ensures minimal residue after reflow with full and reliable solder joints, fully meeting no-clean process requirements.

II. Solder Paste Type – Customizable Powder Size Selection

TS107E, as a Leaded Solder Paste, offers the industry's most extensive range of Solder Paste Type options, including Solder Paste Type 3 (20–38μm), Solder Paste Type 4 (15–25μm), Solder Paste Type 4.5 (proprietary ultra-fine powder distribution), and Solder Paste Type 5, customizable according to specific application requirements. Among these, Solder Paste Type 4.5 and Solder Paste Type 5 are exclusive options for this SnPb Solder Paste, fully satisfying diverse printing precision needs.

Solder Paste Type	Particle Size Range	Metal Content	Typical Application
Solder Paste Type 3	20–38μm	88.0%	Standard printing
Solder Paste Type 4	15–25μm	88.3% / 84.0%	Fine-pitch printing
Solder Paste Type 4.5	Proprietary distribution	—	Ultra-fine pitch printing
Solder Paste Type 5	—	88.3% / 78.0%	Ultra-fine pitch printing / solder dotting

The Solder Paste Type 4.5 and Solder Paste Type 5 options of TS107E represent a significant advantage of this SnPb Solder Paste over other Leaded Solder Paste products, particularly suitable for ultra-fine pitch applications (down to 200μm/8mil aperture).

III. SnPb Solder Paste and Alloy Advantages

TS107E is a typical SnPb Solder Paste utilizing the Sn63/Pb37 eutectic alloy. As a Leaded Solder Paste, this SnPb Solder Paste offers the following core advantages:

• Eutectic characteristics: Melting point of 183°C with no plastic zone, rapid solidification during soldering, reducing cold joint risks
• Mature technology: Sn63/Pb37 is the most widely applied alloy system among Leaded Solder Paste products
• Superior wettability: Excellent performance across various PCB surface finishes, particularly suitable for CuOSP surfaces
• Cost-effectiveness: Compared to lead-free alloys, SnPb Solder Paste offers more competitive material costs

TS107E, as a SnPb Solder Paste, demonstrates complete alloy coalescence after reflow, achieving uniform and full solder joints even on apertures as small as 200μm.

IV. Solder Flux and Electrical Reliability

The Solder Flux in TS107E employs an ROL0-grade activator system (the highest reliability level per IPC J-STD-004), and is halogen-containing (confirmed by titration test and silver halide test). This Solder Flux ensures the SnPb Solder Paste passes all of the following tests:

Test Item	Result	Standard
Copper Mirror Test	PASS	IPC J-STD-004
Copper Corrosion Test	PASS	IPC J-STD-004
SIR (IPC, 85°C/85%RH, 7 days)	PASS, 8.6×10⁹Ω	≥1×10⁸Ω
SIR (Bellcore, 35°C/85%RH, 96h)	PASS, 2.1×10¹¹Ω	≥1×10¹¹Ω
Electromigration (Bellcore, 65°C/85%RH, 500h, 10V)	PASS (Initial 3.9×10⁸Ω → Final 1.9×10⁹Ω)	Final > Initial/10
Halogen Content	PASS (Non-detectable <50ppm)	EN14582

This Solder Flux system ensures TS107E leaves colorless, transparent, dry, and reliably insulating residue after reflow, meeting no-clean process requirements while delivering IPC Class III voiding performance (the highest IPC 7095 classification).

V. Solder Paste Printer and Printing Performance

TS107E demonstrates exceptional printing consistency and high process capability index on the Solder Paste Printer. The printing parameters for this SnPb Solder Paste are as follows:

• Printing Speed: 25–150mm/s (1–6 in/s), supporting high-speed printing for fast cycle times and high throughput
• Squeegee Pressure: 0.18–0.27kg/cm (1.0–1.5lbs/inch); higher speeds require increased pressure
• Squeegee Angle: 60° (standard)Squeegee Material: Metal squeegee or polyurethane rubber squeegee (hardness 80–90 Shore)
• Stencil Thickness: 100–150μm (4–6mil)Stencil Separation Speed: 3–10mm/s
• Stencil Material: Recommended Alpha series electroformed/laser-cut stencils

TS107E exhibits minimal viscosity variation during continuous printing on the Solder Paste Printer, maintaining stable printing performance at 25°C/50%RH, significantly reducing cleaning frequency and improving production line efficiency. This Leaded Solder Paste is particularly well-suited for high-throughput production applications.

VI. Solder Paste Mixer and Process Guidelines

TS107E must be stored refrigerated at 0–10°C (shelf life: 6 months). Prior to use, the Solder Paste must be allowed to sit at room temperature for approximately 4 hours for thawing (ensure temperature ≥19°C before opening), followed by mixing via a Solder Paste Mixer or manual stirring:

• Manual Mixing: Can be stirred with a spatula until uniform
• Solder Paste Mixer (centrifugal type): Recommended speed below 300 RPM, with stoppage after every 30–60 seconds of mixing
• Important Note: Never mix Solder Paste recovered from the stencil with unused paste in the same container, as this will alter the rheological properties of the unused Solder Paste

After printing this SnPb Solder Paste on the Solder Paste Printer, it is recommended to complete reflow as soon as possible. The reflow profile recommends a peak temperature of 210–220°C (above the 183°C melting point), and can be performed in air or nitrogen atmospheres.

VII. Low Head-in-Pillow Defects and High Probe Testability – Core Differentiating Advantages

TS107E, as a Leaded Solder Paste, offers two industry-leading core advantages:

1. Low Head-in-Pillow Defect Rate

This SnPb Solder Paste delivers industry-leading head-in-pillow defect prevention performance in BGA/CSP component soldering, effectively reducing open defects caused by PCB warpage and component coplanarity issues, improving first-pass yield. This characteristic establishes TS107E's unique position in the Leaded Solder Paste market.

2. Excellent Probe Testability

TS107E provides best-in-class in-circuit probe test yield. After reflow, the solder joint surface exhibits minimal and colorless transparent flux residue, resulting in low probe contact resistance and significantly reducing ICT (in-circuit test) misjudgments. This SnPb Solder Paste's excellent probe testability makes it the preferred choice for leaded process ICT testing applications.

3. Low Voiding

TS107E meets IPC 7095 Class III voiding performance (the highest level), ensuring long-term reliability.

VIII. Application Scenarios and Supply Capacity

This SnPb Solder Paste has been deployed in volume production across the following sectors:

Application Area	Typical Products	This Leaded Solder Paste Advantage
Communication Equipment	Base stations, routers, switches	High reliability, low voiding, high ICT probe test yield
Industrial Controls	PLC, industrial motherboards, power modules	Wide process window, long-term reliability
Automotive Electronics	Headlamps, sensors, BMS	IPC Class III voiding performance, thermal cycle resistance
Consumer Electronics	Smart wearables, TWS earbuds (leaded process)	Ultra-fine printing (Type 4.5/5), high-speed production
Aerospace/Military (exempted)	High-reliability modules	Mature Sn63/Pb37 alloy, ROL0-grade Solder Flux

TS107E, as a SnPb Solder Paste, serves over 50 customers with a monthly production capacity exceeding 3 tons and ample inventory, enabling delivery within 48 hours.