TS505 is a high‑temperature, no‑clean solder paste lead free based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy, with a melting range of 217–218°C. Engineered for demanding SMT applications, this solder paste lead free delivers outstanding print stability, excellent wetting on OSP and mildly oxidized pads, and exceptionally low voiding – critical for QFN, LGA, and large thermal‑pad components. Its halogen‑controlled flux (0.085%, L1 level) leaves a dry, non‑conductive residue that passes stringent SIR tests (≥1.0×10⁸Ω at 40°C/90% RH and ≥5.0×10⁸Ω at 80°C/85% RH), supporting no‑clean processes and reliable ICT probing. The wide reflow window (peak 240–250°C, with 60–90 seconds above liquidus) accommodates diverse PCB designs and reduces defects like bridging and tombstoning.
The transition to lead‑free electronics manufacturing has reshaped every aspect of the surface‑mount process—from alloy selection and reflow profiling to stencil design and inspection criteria. Among the most critical decisions a production engineer makes is the choice of a solder paste lead free that not only meets regulatory requirements but also delivers consistent printability, robust wetting, and long‑term joint reliability. With component densities rising and thermal demands increasing, the performance of your solder paste lead free directly impacts first‑pass yields, rework rates, and field failures.
TS505 is a high‑temperature solder paste lead free formulated to address these challenges head‑on. Based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy system, this no‑clean paste offers a carefully balanced flux chemistry that ensures excellent print stability, low voiding, and superior wetting across a wide range of PCB finishes. Whether you are assembling telecom infrastructure, automotive ECUs, or consumer wearables, TS505 provides the process robustness that modern SMT lines demand—all while fully complying with global environmental standards.
What Makes TS505 a Superior Solder Paste Lead Free?
A truly reliable solder paste lead free must harmonize multiple, often conflicting, performance attributes: stable rheology over hours of printing, adequate flux activity for challenging surfaces, minimal slump, and a residue that remains benign and testable. TS505 achieves this balance through a meticulously designed SAC0307 alloy and a halogen‑controlled flux system that activates progressively during reflow. This solder paste lead free offers a melting range of 217–218°C, placing it firmly within the high‑temperature lead‑free category, and is compatible with both air and nitrogen reflow environments.
The alloy composition is tightly controlled to ensure consistent intermetallic formation and mechanical strength, while the flux vehicle is optimized to provide rapid oxide removal without leaving excessive or conductive residues. As a result, TS505 is a solder paste lead free that you can trust for mission‑critical applications where every joint must pass stringent electrical and thermal tests.
Product Specifications
Alloy Composition
Alloy Physical Properties
Solder Paste Specification
Reflow Profile
Core Advantages of This Solder Paste Lead Free
1. Wide Reflow Process Window for Maximum FlexibilityTS505 is a solder paste lead free that offers a generous reflow window, enabling it to accommodate boards of varying thicknesses, densities, and thermal masses. The recommended profile is as follows:
This wide window allows this solder paste lead free to perform reliably across different oven types (infrared, hot air) and atmospheres (air or nitrogen), effectively minimizing common defects such as solder beads, bridging, and tombstoning.
2. Outstanding Wettability and Solder Wicking
The flux system in TS505 is activated progressively during reflow, ensuring rapid wetting even on OSP‑coated or mildly oxidized pads. This solder paste lead free produces bright, full fillets with excellent capillary climb, resulting in strong mechanical and electrical connections. Whether you are dealing with ENIG, HASL, or immersion silver finishes, TS505 delivers consistent wetting performance.
3. Low Voiding – Critical for High‑Reliability Joints
Voiding remains one of the primary concerns with large thermal‑mass components such as QFN, LGA, and thermal pads. TS505’s flux formulation is engineered to promote efficient gas escape during reflow, significantly reducing void fractions. This solder paste lead free has been validated in demanding applications where voiding below 25% is a strict requirement.
4. Excellent Printability and Stencil Life
TS505 exhibits outstanding rollability and thixotropic recovery, making it highly compatible with automated printing lines. Its viscosity remains stable throughout extended runs, and the paste resists drying on the stencil, reducing cleaning frequency. This solder paste lead free ensures consistent deposit geometry even on fine‑pitch pads down to 0.4 mm, contributing to higher first‑pass yields.
5. Minimal Residue and High Insulation Resistance
After reflow, TS505 leaves a dry, translucent residue that is non‑conductive and probe‑friendly. This solder paste lead free passes stringent Surface Insulation Resistance (SIR) tests under both standard and elevated humidity conditions:
These properties make this solder paste lead free ideal for no‑clean processes, eliminating the need for post‑reflow cleaning while ensuring long‑term electrical reliability.
Typical Applications for This Solder Paste Lead Free
TS505 is a versatile solder paste lead free that excels in:
Frequently Asked Questions
Q: Is TS505 a true lead‑free solder paste?
A: Yes. TS505 is a solder paste lead free compliant with RoHS and other global regulations, with a lead content of ≤0.10%.
Q: Can this solder paste lead free be used in both air and nitrogen reflow?
A: Absolutely. TS505 is designed for use in both atmospheres, offering excellent wetting and low voiding in either condition.
Q: What stencil type works best with TS505?
A: Laser‑cut stainless steel stencils with electro‑polished apertures are recommended for optimal release and deposit fidelity with this solder paste lead free.
Q: Does TS505 support paste‑in‑hole (PiH) applications?
A: Yes, its stable rheology and flux activity make TS505 suitable for PiH processes.
Q: How long can TS505 remain on the stencil during production?
A: Under standard shop‑floor conditions (20–25°C, RH <65%), TS505 maintains its print performance throughout a typical shift, reducing downtime and improving productivity.
Package and Shipping
Each 500g bottle of this solder paste lead free is packed in wide‑mouth plastic (PE) containers with an inner seal to preserve freshness. Bottles are shipped in foam‑lined boxes, with a maximum of 20 bottles per box, ensuring internal temperatures remain below 35°C during transit.
Quality Assurance – Consistency You Can Rely On
Every batch of TS505 is subjected to rigorous quality control, with a Certificate of Analysis provided to verify:
Our quality system ensures that every shipment of this solder paste lead free delivers identical performance, giving you the confidence to run high‑volume production without unexpected process variation.
Conclusion
Selecting the right solder paste lead free is a strategic decision that influences every stage of SMT assembly—from printing to reflow to final test. TS505 offers a proven combination of wide process window, excellent wetting, low voiding, minimal residue, and outstanding printability. It is a solder paste lead free that bridges the gap between stringent environmental mandates and the demanding performance requirements of modern electronics.
By choosing TS505, manufacturers can achieve:
For those seeking a robust, high‑quality solder paste lead free that performs reliably in both standard and challenging environments, TS505 is the trusted solution.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
For inquiries about alternative alloys, custom powder sizes, or specific formulations of solder paste lead free, please contact your local Tensan sales representative.
