Solder paste lead free Manufacturers

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Solder paste lead free, Our solutions are mainly exported to Europe, Africa, America, the Middle East and Southeast Asia and other countries and regions. We now have enjoyed a great reputation among our customers for quality products and good services.We would make friends with businessmen from at home and abroad, following the purpose of "Quality First, Reputation First, the Best Services."

Hot Products

  • Lead-Free Solder Paste

    Lead-Free Solder Paste

    TENSAN TS‑501 is a Lead-Free Solder Paste engineered to meet these demands. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste lead free solution offers a lower melting point than conventional SAC alloys, making it ideal for assemblies with thermal‑sensitive components, flexible PCBs, and step‑soldering processes. With Type‑4 powder, ROL1 flux classification, and no‑clean residue, TS‑501 is the lead-free solder paste that combines environmental responsibility with outstanding process performance.
  • Tin-Lead Composition Solder Bar Welding Material

    Tin-Lead Composition Solder Bar Welding Material

    TS‑350 is a lead‑free, no‑clean solder paste whose carefully balanced solder paste composition (SAC305 alloy, Type 4 powder, and a halogen‑free flux system) delivers outstanding printability and superior wetting. The composition ensures stable viscosity (220,000 ± 30,000 mPa·s) for fine‑pitch printing down to 0.25 mm, rapid oxide removal, and low voiding on QFN/BGA packages. It leaves a dry, non‑conductive residue (~5 % w/w) that passes SIR tests and supports ICT without cleaning.
  • Solder Paste – Automatic Mixer Compatible (Sn42Bi58)

    Solder Paste – Automatic Mixer Compatible (Sn42Bi58)

    Specifically engineered to streamline SMT preparation processes, Solder Paste – Automatic Mixer Compatible (Sn42Bi58) combines a high‑reliability flux system with fine spherical Sn42/Bi58 alloy powder. This advanced Solder paste mixer‑friendly product is formulated to achieve rapid, homogeneous mixing with minimal aeration, ensuring consistent viscosity and printability across every batch. Its eutectic composition provides a sharp melting point at 138 °C, enabling energy‑efficient reflow while protecting temperature‑sensitive components – and its robust rheology guarantees that after mixing with any standard Solder paste mixer, the paste delivers identical performance to freshly manufactured material.
  • Automatic Solder Paste Printer for PCB Board

    Automatic Solder Paste Printer for PCB Board

    TS505 is a lead‑free, high‑temperature solder paste based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy (melting point 217–218°C), formulated for high‑reliability SMT assembly. Its advanced rheology ensures seamless compatibility with any solder paste printer – manual, semi‑automatic, or fully automated – delivering consistent transfer, excellent shape retention on fine‑pitch pads (down to 0.4 mm), and extended stencil life with reduced cleaning stops.
  • TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant

    TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant

    LED-optimised 1.3W/m·K Thermal adhesive: Engineered for COB LEDs, downlights & high-brightness fixtures. Thermal interface minimises hotspot formation in high-density arrays. 0.8 MPa shear strength. Low volatility (<0.1%) prevents lens fogging.
  • High Reliability Solder Paste for Automotive Electronics

    High Reliability Solder Paste for Automotive Electronics

    the TS-506 solder paste for automotive electronics – a proven alloy‑flux system that meets the stringent demands of engine control units, LED lighting, and sensor modules.

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