High tackiness solder paste for double-sided reflow Manufacturers

Our enterprise insists all along the quality policy of "product high-quality is base of organization survival; customer gratification will be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" and also the consistent purpose of "reputation very first, purchaser first" for High tackiness solder paste for double-sided reflow, In addition, we would properly tutorial the purchasers about the application techniques to adopt our items plus the way to select appropriate materials.
High tackiness solder paste for double-sided reflow, We've more than 200 staff including experienced managers, creative designers, sophisticated engineers and skilled workers. Through hard work of all employees for the past 20 years own company grew stronger and stronger. We always apply the "client first" principle. We also always fulfill all contracts to the point and therefore enjoy excellent reputation and trust among our customers. You are very welcome to personally visit our company.We hope to start a business partnership on the basis of mutual benefit and successful development . For more information remember to do no hesitate to contact us.

Hot Products

  • Automatic Solder Paste Mixer

    Automatic Solder Paste Mixer

    TENSAN TS‑503 is a lead‑free, no‑clean solder paste designed for medium‑temperature reflow processes.
  • Lead-Free Solder Paste with Stable Printing & Fine Soldering

    Lead-Free Solder Paste with Stable Printing & Fine Soldering

    This product is ROHS, REACH compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
  • Automatic SMT Stencil Printer Solder Paste Printing

    Automatic SMT Stencil Printer Solder Paste Printing

    TS-350 is a lead-free no-clean high-performance solder paste compatible with all types of SMT printers, suitable for general assembly and ultra-fine pitch processes down to 0.28mm, and supports PiH paste-in-hole technology for complex components like BGA and QFN. It features stable printability, superior wetting, low void rate and excellent HiP resistance with a wide reflow window for air and nitrogen reflow environments. Low transparent non-conductive residues allow direct ICT testing without cleaning. RoHS-compliant with consistent lot-to-lot performance, it serves consumer, automotive, industrial, medical and telecom electronics, boosting first-pass yield and cutting rework & downtime costs.
  • No-Clean Solder Paste

    No-Clean Solder Paste

    In modern SMT assembly, the choice of solder paste directly impacts production efficiency, component reliability, and long‑term product performance. TENSAN TS‑503 is a No-Clean Solder Paste engineered specifically for medium‑temperature reflow processes, offering the ideal balance between thermal protection and soldering performance. This advanced solder paste formulation features a unique Sn‑Ag0.3‑Bi35 alloy, delivering a significantly lower melting point than conventional SAC305 pastes while maintaining excellent wettability and joint reliability. As a true No-Clean Solder Paste, TS‑503 eliminates post‑reflow cleaning, reduces process costs, and ensures high electrical reliability – making it the preferred solder paste for LED lighting, flexible circuits, and heat‑sensitive component assemblies.
  • Lead-Free High-Temperature Solder Paste

    Lead-Free High-Temperature Solder Paste

    TS-350-1 is a lead-free high-temperature solder paste. This SnAgCu Solder Paste utilizes the Sn96.5Ag3Cu0.5 (SAC305) alloy system with a melting point of 221–227°C, specifically designed for high-reliability electronic assembly. TS-350-1 is precision-engineered with Solder Paste Type 4 (20–38μm) spherical solder powder and Solder Flux, delivering excellent printing performance and extended stencil life on the Solder Paste Printer. Prior to use, thorough mixing via a Solder Paste Mixer is recommended to ensure uniform Solder Paste Composition. This Solder Paste Lead Free product has been widely adopted in high-temperature soldering applications including telecom base stations, server motherboards, automotive electronics, and industrial controls.
  • Lead-Free Solder Paste

    Lead-Free Solder Paste

    TENSAN TS‑501 is a Lead-Free Solder Paste engineered to meet these demands. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste lead free solution offers a lower melting point than conventional SAC alloys, making it ideal for assemblies with thermal‑sensitive components, flexible PCBs, and step‑soldering processes. With Type‑4 powder, ROL1 flux classification, and no‑clean residue, TS‑501 is the lead-free solder paste that combines environmental responsibility with outstanding process performance.

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