Thermally conductive potting compounds are suitable for a variety of harsh environments and high-end precision/sensitive electronic devices. Automotive electronics, modules, LED power drive modules, solar module junction boxes, electric vehicle charging column modules, lithium battery packs, capacitor packs, magnetic induction coils, and inverter power supplies, not only enhance the waterproof, shock resistance, and heat dissipation performance of electronic products, It can also protect it from the erosion of the natural environment and prolong its service life.
Thermally conductive electronic potting glue is liquid before curing and has fluidity. The viscosity of the glue varies according to the product's performance, material, and production process. The thermal conductivity electronic potting compound can realize its use value only after it is completely cured. So what performance requirements do electronic potting compounds suitable for electronic components need to meet?
1. The colloid has no corrosive effect on electronic components;
2. The cured colloid will not be deformed even after mechanical processing;
3. Strong resistance to cold and heat changes, even if subjected to cold and heat changes between -60°C and 200°C, the colloid can still maintain elasticity and not crack;
4. Electronic potting silicone rubber can be cured at room temperature or heated;
5. It has excellent thermal conductivity, which can effectively improve the heat dissipation capacity of electronic products after potting; especially now, the thermal conductivity of high thermal conductivity products is required to be 2.0-3.0W/m.k
6. It has excellent weather resistance and salt spray resistance to ensure that electronic components are not eroded by the natural environment;
7. Strong electrical insulation ability, which can effectively improve the insulation between internal components and lines after potting;
8. Electronic potting silicone rubber has hydrophobic properties, which can improve the moisture-proof performance of electronic components after potting.
The potting of electronic products are generally made of silicone material. The silicone potting can be added with some functional fillers to give it electrical conductivity, thermal conductivity, magnetic conductivity, and other properties. The mechanical strength of silicone encapsulant is generally poor, and it is precisely this performance that is used to make it "breakable" for easy maintenance, that is if a component fails, you only need to pry open the encapsulant and replace it with a new one. After the original copy, you can continue to use it.
