In today's market, electronic potting compounds are more popular and can shine in many industries. Why is this adhesive popular in the market, and why is the usage rate so high? It is closely related to its own performance!
What are the characteristics of electronic potting glue?
1.It has good adhesion and can be bonded with electronic components, circuit boards and other materials. During use, you will find that its adhesiveness is significantly stronger than that of ordinary potting adhesives, and it is particularly durable.
2.It has good fluidity and can penetrate directly into small gaps without leaving any gaps, improving the protective effect.
3.It is easy to cure and can be cured at room temperature, and the fine air bubbles can be removed without affecting normal use. During the whole process, there is almost no shrinkage and no by-products are released. Cooperate with powerful suppliers, such as TENSAN, which focuses on the research of electronic potting adhesives, and provides customized electronic potting adhesive application solutions. It has a wide range of uses and can be applied to new energy, military industry, medical treatment, aviation, and ships. , electronics, automobiles, instruments, power supplies, high-speed rail and other industries.
4.The weather resistance is very good, it will not be frozen in the cold environment of minus 60 degrees, and will not be melted in the environment of 250 degrees, and it will function normally.
Is the method of using electronic potting compound complicated?
1. Weighing: Weigh the AB agent according to actual needs to minimize errors.
2. Stirring: Prepare a special vessel and a stirring rod, mix the two groups of materials together, and stir evenly.
3. Pouring: After the two groups of materials are evenly mixed, the potting needs to be completed as soon as possible, otherwise it will become sticky and affect the use.
4. Curing: The initial curing time is very short, and it takes 24 hours to completely cure. If the room temperature is higher, the curing speed will be faster.
What are the precautions when using it?
Do not change the ratio of AB agent at will, and operate in strict accordance with the instructions. Once the preparation ratio is changed without authorization, it may cause waste.
When the electronic potting compound is curing, the speed is directly related to the temperature. If you want to shorten the curing time, you can heat it appropriately.
