Potting is to mechanically or manually pour the liquid polyurethane compound into the device with electronic components and circuits, and solidify it into a thermosetting polymer insulating material with excellent performance under normal temperature or heating conditions.
Potting glue is also called electronic glue, and its main functions are bonding, sealing, potting, coating, etc. Thereby, it plays the role of moisture-proof, dust-proof, anti-corrosion and shock-proof for electronic and electrical components, and improves the performance and stability parameters, and it is liquid before vulcanization, which is convenient for pouring and use.
Now that we know about potting compounds, what are the most commonly used potting compounds in the electronic world?
Most of the current electronic products are potted with silicone potting glue, polyurethane potting glue and epoxy potting glue. Because these three glues can be selected for different products. Its adhesion is very good, and it is also very good in sealing and waterproofing. The following is a detailed explanation of the differences between these three potting adhesives.
The long-term and effective protection of sensitive circuits and electronic components undoubtedly plays an increasingly important role in today's sophisticated and demanding electronic applications, and two-component silicone potting materials are undoubtedly one of the best choices. Silicone potting material has stable dielectric insulation, which is an effective guarantee to prevent environmental pollution, and can eliminate the stress caused by shock and vibration in a large temperature and humidity range.
Polyurethane potting glue
Polyurethane elastic potting compound overcomes the brittleness of commonly used epoxy resin and the disadvantages of low strength and poor adhesion of silicone resin, and has excellent water resistance, heat resistance, cold resistance, ultraviolet resistance, acid and alkali resistance, high and low temperature impact resistance , Moisture-proof, environmental protection, cost-effective and other characteristics, it is an ideal potting protection material for electronic components.
Epoxy potting glue has good fluidity and is easy to penetrate into the gap of the product; it can be cured at room temperature or medium temperature, and the curing speed is moderate; after curing, there are no bubbles, the surface is smooth, shiny, and high hardness; the cured product has good acid and alkali resistance. Moisture-proof, water-proof, oil-proof and dust-proof performance is good, resistant to heat and humidity and atmospheric aging; it has good electrical and physical properties such as insulation, compression resistance, and high bonding strength.
Among them, the silicone potting compound is divided into two-component condensation type silicone potting compound and two-component addition type silicone heat-conducting potting compound.
Condensation-type potting adhesives are available in transparent, black, and white, and are widely used for potting protection of high-power electronic components, module power supplies, circuit boards and LEDs.
The addition-type heat-conducting potting compound is gray and is widely used in products that require high heat dissipation, flame retardancy, and high temperature resistance, such as automotive electronics, HID ballasts, power modules, sensors, circuit boards, transformers, and amplifiers.
