With the rapid development of the electronics industry, people pay more attention to the stability and user experience of electronic products, and have stricter requirements on safety and reliability. Potting glue plays a vital role in the rapid upgrading of electronic products, such as bonding, heat conduction, shock and shock absorption, sealing, insulation and so on.
Introduction of silicone potting compound
Silicone potting compound is a composite material prepared from silicone material. The most common silicone potting adhesive consists of two components (A, B components), including addition type and condensation type.
The addition-type potting compound can be cured by platinum-catalyzed vinyl cross-linking reaction, which can be deeply potted, and no low-molecular substances are produced during the curing process, the shrinkage rate is extremely low, and it adheres well to the component or potting cavity wall.
Condensation-type potting glue condenses with 107 glue and water vapor in the air, and removes small molecules such as acid, alcohol, and oxime to solidify. The shrinkage rate is high and the adhesion to cavity components is low.
One-component potting adhesive also includes condensation type and addition type. The condensation type is generally only suitable for shallow layer (maximum curing thickness 10mm) potting, while the addition type generally requires low temperature storage (refrigerator), and heating and curing after potting.
Advantages, disadvantages and scope of application of silicone potting adhesive
Advantages: strong anti-aging ability, good weather resistance, waterproof performance, excellent impact resistance, earthquake resistance, electrical performance and insulation ability. It has excellent resistance to cold and heat changes, can be used in the temperature range of -60°C to 200°C and maintains elasticity without cracking; it is not corrosive to electronic components; it has excellent repairability, and can be easily and quickly sealed. The components are taken out for repair and replacement.
Disadvantages: poor adhesion.
Scope of application: suitable for potting various high-end precision/sensitive electronic devices that work in harsh environments. Such as LED, display screen, photovoltaic material, diode, semiconductor device, relay, sensor, car ballast HIV, car computer ECU, etc., mainly play the role of insulation, moisture proof, dust proof and shock absorption.
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