There are many electronic potting adhesives on the market, which can be divided into one-component and two-component according to the composition. In fact, the difference between one-component and two-component is that one-component can be cured directly without adding any supporting products. The two-component one needs to add curing agent in proportion to cure.
One-component thermal conductive potting adhesive
The one-component heat-conducting potting compound belongs to room-temperature-curing organic potting compound, and the one-component electronic heat-conducting potting compound is refined from imported organic silicon as the main raw material and other ingredients. It releases low molecules through condensation reaction with water in the air to cause crosslinking, and vulcanizes into a high-performance monomer. After it is completely cured, it has excellent resistance to high and low temperature changes, and will not be damaged by contact gaps after the components are fixed. Reduce cooling effect.
The one-component heat-conducting potting adhesive has excellent thermal conductivity and heat dissipation performance, and also has superior electrical properties, aging resistance, anti-cold and heat alternating performance, moisture-proof and non-swelling, electrical insulation performance, power decline rate, shockproof, waterproof, Vibration absorption and stability increase the safety factor of electronic products during use.
Two-component thermally conductive potting adhesive
The two-component thermally conductive potting compound is used as a heat transfer medium for electronic device cooling, and can be cured in place to a soft elastomer without stress on electronic components. After curing, it is tightly attached to the contact surface to reduce thermal resistance, which is more conducive to the heat conduction between the heat source and the surrounding heat sink, motherboard, metal shell and shell.
The two-component heat-conducting potting adhesive has the advantages of high thermal conductivity, good insulation performance, and easy use, and can be widely used in the packaging of integrated circuits, integrated chips, converters, and other power modules, semiconductors, relays, rectifiers, and transformers. At the same time, the two-component heat-conducting potting adhesive has good high and low temperature resistance, excellent weather resistance, radiation resistance, superior dielectric properties, stable chemical properties and mechanical properties, and can protect electrical components more effectively.
The difference between one-component thermal conductive potting adhesive and two-component thermal conductive potting adhesive
The one-component thermally conductive adhesive has strong adhesion to the metal surface and is not easy to peel off. It is widely used in the bonding and sealing of PTC sheets and aluminum heat sinks, as well as the coating and fixing of plug-in wires or sheets on the sensor surface. It is mainly used in CPU heat sinks, heat dissipation between crystal tubes, chips and heat sinks, heat conduction glue for heat dissipation of electric iron soleplates, heat conduction of transformers and fixing of electronic components, followed by filling. The two-component thermally conductive potting adhesive can be easily peeled off from the electronic components because of its elasticity after curing, ensuring that the electrical appliances can be repaired and more environmentally friendly.
