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Factors affecting the curing of electronic sealants


Electronic sealant is a special adhesive that is widely used in the electronics industry. However, in order to be used normally, its excellent performance can only be demonstrated after it is completely cured. During the curing process of electronic sealants, the speed may be fast or slow, which has a great impact on the performance. Only by understanding the factors that affect the curing speed can it be more useful.

Adhesive type: Different types of adhesives have different initial and depth cure speeds. Good quality adhesives take a few minutes to surface cure and are fully cured after 24 or 72 hours. Inferior adhesives are not easy to cure and require seven or eight days or even longer to completely cure, delaying work progress.

Substrate: Electronic sealants usually need to be used in conjunction with a substrate (such as plastic, metal, glass, etc.). The surface treatment quality and roughness of the substrate will affect the curing effect of the electronic sealant. Therefore, when selecting electronic sealants, the appropriate glue type should be selected according to the properties of the base material, and appropriate surface treatment should be performed.

Temperature: Temperature has a huge impact on how quickly electronic sealants cure. The higher the temperature, the faster the cure rate. Although increasing the temperature can speed up the curing speed, too high a temperature may cause the adhesive layer to harden too quickly and form cracks. Low temperature will cause slow or even impossible curing. Therefore, when selecting curing conditions, the appropriate temperature should be selected based on the specific application scenario and product properties.

Humidity: Electronic sealants need to absorb moisture in the air during the curing process, so the higher the air humidity, the faster the curing speed will be.

Contact area: The contact area between the electronic sealant and the air will also affect the curing speed. Poor ventilation conditions in the construction environment, or the gap is too wide or deep, will reduce the curing speed. Especially for electronic sealants that need to be applied on non-porous substrates (such as glass, aluminum, metal, etc.), only one side can be exposed to air, and the other three sides are basically airtight, so the curing speed will be relatively prolonged.

Glue thickness: The curing of electronic sealants is from the surface to the inside. A coating that is too thick will prolong the curing time and easily form bubbles and cracks; but a coating that is too thin may cause the glue layer and the base material to be separated. Insufficient adhesion. Therefore, during the production process, the glue coating thickness should be controlled according to the adhesive's product technical instructions and usage conditions to ensure the performance and quality of the adhesive layer.

The curing time of electronic sealants is affected by many factors, such as temperature, humidity, glue thickness, etc. In actual production, these factors should be comprehensively considered based on specific application scenarios and product properties, and appropriate curing conditions and methods should be selected to ensure the performance and quality of electronic sealants. At the same time, continuous research and exploration of new curing technologies and materials are also an important way to improve the performance and adaptability of electronic sealants.

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