Industry dynamic

Thermal pads

2020-06-22

Thermal pads

Thermal pads or ground pads are thin, lightweight pads that are common among hikers, backpackers and budget travelers. In its simplest form a thermal pad consists of a foam-like material that is about half a centimetre thick (about a quarter of an inch). The dimensions of the pad are usually about the same length as a sleeping bag and a little wider. Slight variations in design can be found, such as rippling in the foam, but these do not significantly affect the pad‘s thermal properties.

A common misconception is that thermal pads are for creating a more comfortable sleeping or picnic spot. This is what gives rise to their other name ‘ground pads‘. In fact, the purpose of the thermal pad is to prevent the loss of body heat into the ground while sleeping. The foam pad, which is filled with air bubbles, slows down the conduction of heat through the pad since air is one of the best (and cheapest) insulators.

What Is Non-silicone Thermal Pad?

In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are a pre-formed square or rectangle of solid material (often paraffin or silicone based) commonly found on the underside of heat sinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminum or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact; they would not be needed between perfectly flat and smooth surfaces. Thermal pads are relatively firm at room temperature, but become soft and well able to fill gaps at higher temperatures.

For special applications, non-silicone thermal pad may be required. Most commonly seen is Acryl-based non-silicone thermal conductive pad. The applications may include electronic components: ICCPUMOSLEDM/BP/SHeat SinkLCD-TVNotebook PCPCTelecom DeviceWireless HubDDR II ModuleDVD ApplicationsHand-set applications, etc.  
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