Two-component thermally conductive silicone, used as a heat transfer medium for cooling electronic devices, can be cured in position to form a soft elastomer that does not produce stress on electronic components. After curing, it fits closely to its contact surface and reduces thermal resistance, thus facilitating the heat transfer between the heat source and its surrounding heat sink, motherboard, metal case and shell, with high thermal conductivity, good insulation and ease of use.The advantages include high thermal conductivity, good insulation and ease of use.
3.Single component is only suitable for small area potting, thickness should not exceed 6mm, two-component is more suitable for large area potting operation, low viscosity, good fluidity, suitable for complex electronic parts moulding.
