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  • china waterproof potting compound ,china waterproof potting silicone,thermal conductivity potting compound,thermal conductivity of potting compounds,thermal conductivity potting material,thermal conductivity of potting material

    2020-06-17

  • The thermally conductive silicone pad fills the air gap between the heat-generating device and the heat sink or metal base. Their flexible and elastic characteristics allow them to be used to cover very uneven surfaces. Heat is conducted from the separation device or the entire PCB to the metal casing or diffusion plate, and the thermally conductive silicone pad can improve the efficiency and service life of the heating electronic component.

    2020-06-16

  • In order to solve the heat dissipation problem of electronic and electrical products and to ensure the stability and performance of the products, different types of thermally conductive materials are usually required. Shenzhen Tensan tells you: the advantages of thermal conductive double-sided tape compared to other thermal conductive materials.

    2020-06-16

  • Thermally conductive double-sided adhesive tape is a product with adhesive on both sides. Compared with other thermally conductive materials, it has excellent adhesive properties. In order to ensure the quality of thermally conductive double-sided adhesive tape, manufacturers need to carry out tape peeling test.

    2020-06-15

  • Addition molding encapsulant is a kind of liquid silicone rubber, which is composed of vinyl polydimethylsiloxane, hydrogen-containing silicone oil cross-linking agent, platinum catalyst, functional filler and some additives. Compared with the general potting compound,

    2020-06-12

  • What material potting compound is suitable for LED light bars? Considering the actual application environment and requirements of LED light bars, silicone potting compound is more suitable for epoxy resin potting compound and polyurethane potting compound. On the LED light bar, Shenzhen Tensan will talk to you specifically.

    2020-06-10

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