Industry dynamic

  • In LED heat dissipation, there is no absolute superiority of thermal pads or thermal grease; the choice depends on the application scenario. The two differ significantly in terms of usability, insulation, and lifespan. A detailed comparison is as follows:

    2026-04-16

  • Potting compounds are key materials in the adhesive and electrical manufacturing industries. They come in a wide variety and are highly targeted to specific applications. Only by selecting appropriate products can their protective and reinforcing functions be fully realized.

    2026-04-14

  • Potting compounds are used to encapsulate electronic components. This involves injecting a two-component liquid adhesive into the interior of a product containing electronic components and circuitry. After curing, it forms a thermosetting polymer insulating material, providing protection, insulation, and fixation. However, settling is a common problem with potting compounds during storage and use, and many users struggle to resolve it due to a lack of understanding of the causes. This article briefly analyzes the causes and impacts.

    2026-04-13

  • The application process of transparent potting compounds directly affects their final performance. The application procedure is basically the same as that of ordinary potting compounds. Strictly following the product instructions can effectively ensure bonding, sealing, and insulation effects.

    2026-04-10

  • Silicone potting are a popular product in the adhesive market. With continuously improving performance and an increasingly diverse range of applicable scenarios, they are particularly favored by many manufacturers in industrial production due to their stable performance and wide applicability.

    2026-04-08

  • In the electronics industry, silicone adhesives primarily serve core functions such as sealing, fixing, and filling. Their full performance depends on the complete curing of the adhesive. To ensure normal and thorough curing of silicone adhesives, it is crucial to focus on various influencing factors during the deep curing process. The following will break down the key influencing factors and their specific mechanisms.

    2026-04-07

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