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Each individual member from our large performance revenue crew values customers' requirements and organization communication for thermallly conductive silicone,thermal adhesive,thermall sealant,thermal RTV,thermal RTV glue, Trust us and you will gain a lot more. You should truly feel totally free to make contact with us for additional data, we assure you of our greatest notice at all times.
thermallly conductive silicone, We sincerely hope to cooperate with customers all over the world, if you would like to have more information, make sure you kindly contact us, we have been looking forward to building up a great business relationship with you.

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    Heatsink For CPU

    Heatsink For CPU TS88 guarantees that heat generated from the CPU or GPU is dissipated efficiently.In contrast to metal and silicon thermal compound, the Tensan ts88does not compromise over time.
  • SMT Red Glue

    SMT Red Glue

    Features & Benefits Tensan SMT red glue 4109A is a one-component epoxy adhesive, curing at high temperature. SMT red glue is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use
  • TS505

    TS505

    This product is ROHS, REACH compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
  • Liquid Silicone Adhesive

    Liquid Silicone Adhesive

    TENSAN Liquid Silicone Adhesive TS6601 is semi-flow RTV silicone with good waterproof function and sealing strength. Liquid Silicone Adhesive can be used for bonding metal, glass, ceramics etc. material. REACH, ROHS certified MSDS for air/sea shipment Fast curing Non-corrosive to most Copper, Polycarbonate plastics material Excellent waterproof function Excellent sealing performance Good Performance for insulation
  • Excellent Heat Resistance Silicone Encapsulant Waterproof

    Excellent Heat Resistance Silicone Encapsulant Waterproof

    Welcome to buy Excellent Heat Resistance Silicone Encapsulant Waterproof from us. Every request from customers is being replied within 24 hours. Features & Benefits of Thermal Conductive Potting TS8866 Two-component silicone potting, 1 to 1, curing at room temperature. REACH, ROHS, certified Good waterproof Good thermal conductivity Easy to mix and use
  • Multi-functional Silicone Rubber Compound White

    Multi-functional Silicone Rubber Compound White

    Silicone Elastomer White TS9922 Features Flowable Room temperature and heat cure Good dielectric properties Rapid, versatile cure processing controlled by temperature High transparency allows easy inspection of components
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    As we all know, no matter what kind of product people choose, they should follow certain purchasing methods. If you make random choices when purchasing products, it is very likely that the selected products will have a short service life or will not meet the needs of production. So how should people choose the right sealant? What should you pay attention to when choosing a sealant?

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  • How to choose a suitable thermal pad

    Thermal pads are high-performance gap-filling thermally conductive materials, mainly used for the transfer interface between electronic equipment and heat sinks or product shells. They have good viscosity, flexibility, good compression properties and excellent thermal conductivity, making them suitable for use It can completely discharge the air between the electronic components and the heat sink to achieve full contact, conduct heat from the separation device or the entire PCB to the metal shell or the diffusion plate, thereby improving the service efficiency and life of the heating electronic components.

  • What is UV glue

    Shenzhen Tensan Co., Ltd. was established in July 2014 in Shenzhen Special Economic Zone. Our company, as one of the high-tech company, is professional engaged in organic silicone and sizing program R&D, manufacturing, sales and service.

  • How to deal with typical problems may occur during potting process

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