TS-350 is a high-performance no-clean SAC305 lead-free solder paste engineered to solve core pain points of modern high-yield SMT production, including inconsistent printing, voids, Head-in-Pillow (HiP) defects and low first-pass yield. Optimized for ultra-fine pitch miniaturized components, it balances stable rheology, powerful flux activation and reliable long-term electrical performance, compatible with mass manufacturing and precision rework across consumer, automotive, medical, telecom and industrial electronics.
Why a Premium Solder Paste Lead Free Is Critical for High‑Yield SMT Assembly
In today’s electronics manufacturing environment, every line operator and process engineer grapples with the same fundamental issues: inconsistent print deposits, excessive defects, and disappointing first‑pass yields. As component footprints continue to shrink and PCB layouts become more intricate, the choice of solder paste lead free directly influences throughput, quality, and long‑term product reliability.
TS‑350 is precisely such a solder paste lead free – a no‑clean formulation designed for manufacturers who demand ultra‑fine pitch capability without any compromise in soldering performance. This particular solder paste lead free delivers the stability, consistency, and wetting behaviour that modern SMT lines require, whether you are running high‑volume production or performing specialised rework.
What Sets This Solder Paste Lead Free Apart?
An exceptional solder paste lead free must reconcile several competing demands: stable rheology over long print runs, aggressive yet controlled flux activity, minimal slump, and residue that does not impair electrical reliability. TS‑350 achieves this balance through a carefully tuned chemistry that bridges the gap between legacy SnPb processes and today’s lead‑free requirements. Its advanced formulation ensures stable printing even on challenging 0.25 mm (10 mil) pitch pads, while delivering the wetting power needed for robust joint formation.
This solder paste lead free combines advanced rheological control with robust flux activation, making it suitable for standard SMT components as well as demanding applications like QFN, BGA, and other ultra‑fine pitch devices down to 11 mil (0.28 mm) square pads.
Product Specifications
Alloy Composition
Physical & Electrical Properties
Core Advantages of This Solder Paste Lead Free
1. Exceptional Print Performance Over Extended Runs
A reliable solder paste lead free must maintain its rheological properties throughout continuous printing. TS‑350 excels in this area:
2. Superior Wetting and Soldering Quality
Wetting performance is the true test of any solder paste lead free. TS‑350’s flux chemistry promotes rapid oxide removal and thorough spreading across all common surface finishes (ENIG, OSP, HASL, etc.).
3. Minimal, Non‑Conductive Residue
After reflow, this solder paste lead free leaves only about 5% (w/w) of dry, translucent residue. This residue:
4. Outstanding Resistance to Head‑in‑Pillow (HiP) Defects
HiP defects are a persistent challenge with BGA and QFN assemblies. TS‑350 is specifically formulated to resist this failure mode, thanks to its flux chemistry that delays oxide re‑formation during the soak phase. This translates to higher first‑pass yields and fewer rework operations.
5. Full RoHS Compliance
As a genuine solder paste lead free, TS‑350 fully meets the requirements of RoHS Directive 2002/95/EC, providing regulatory assurance for exports to all major global markets.
Storage and Handling – Protecting Your Solder Paste Lead Free
To preserve the performance of this solder paste lead free, follow these guidelines:
Storage Conditions
Handling Procedure
Important: Always warm up sealed containers before opening. Condensation introduces moisture that can cause spattering and voiding during reflow – a risk for any solder paste lead free.
Recommended Reflow Profile
Quality Assurance – Consistency You Can Rely On
Every batch of this solder paste lead free is supplied with a Certificate of Analysis (CoA) that verifies:
Product model and batch number
Alloy compositionFlux content (wt%)
Viscosity at 25°C
Our rigorous quality system ensures that each shipment of this solder paste lead free performs identically, giving you full confidence in your production process.
Typical Applications
TS‑350, as a versatile solder paste lead free, is ideal for:
Frequently Asked Questions
Q: Is this solder paste lead free suitable for both standard and fine‑pitch printing?
A: Absolutely. TS‑350 performs equally well on 0.5 mm pitch and ultra‑fine 0.25 mm (10 mil) pitch applications, making it a truly versatile solder paste lead free.
Q: What stencil technology works best with this solder paste lead free?
A: Laser‑cut, electro‑polished stainless steel stencils (e.g., ALPHA® Stencils) provide optimal release and deposit fidelity.
Q: Can this solder paste lead free be used for paste‑in‑hole (PiH) processes?
A: Yes, its stable rheology and flux activity support PiH applications effectively.
Q: How long can this solder paste lead free remain on the stencil?
A: Under normal shop‑floor conditions, TS‑350 maintains its print quality throughout a full shift. Always reseal unused paste promptly to preserve its properties.
Conclusion
Selecting the right solder paste lead free is one of the most impactful decisions in SMT assembly. TS‑350 delivers everything you need: stable printing, superior wetting, minimal residue, and proven reliability across a wide range of applications. By choosing this solder paste lead free, you can expect:
Consistent, high‑quality solder jointsFor manufacturers seeking a robust, high‑quality solder paste lead free that bridges legacy and advanced processes, TS‑350 remains the proven choice.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
For enquiries about alternative alloys, custom packaging, or specific solder paste lead free formulations, please contact your local Tensan sales representative.
