Sn98.5Ag1.0Cu0.5 Lead-Free Solder Paste

Product Overview & Key Advantages

The TS-506 is a no-clean, halogen-free solder paste formulated for stability and print performance. It balances the high reliability of SAC305 with improved wetting and lower voiding.

Core Benefits:

• Wide Reflow Window: Tolerant to varying oven profiles, reducing setup time.
• Excellent Wettability: Superior pad and lead wetting, even on OSP boards.
• Low Voiding: Minimizes voids under BGAs and large ground pads.
• Long Stencil Life: Consistent print volume over 8+ hours without drying.
• Clear Residues: Minimal, non-corrosive post-reflow residues that are probe-test safe.

Full Technical Specifications

Flux Properties (JIS.Z.3284)

Handling & Application Guide

To achieve optimal results with 【Sn98.5Ag1.0Cu0.5 solder paste】, follow these standard operating procedures.

 Storage & Thawing

• Storage: Keep sealed in a refrigerator at 2°C – 10°C. Do not freeze.
• Thawing: Allow the unopened jar to sit at room temperature for at least 4 hours before opening. This prevents moisture condensation.

 Printing Parameters

• Squeegee: 60° angle recommended. 
• Stainless steel is ideal.
• Pressure: ~200 g/cm². 
• Adjust until the stencil is cleanly wiped.
• Speed: Dependent on board complexity and stencil thickness.

• Standard Jar: 500 g per jar.
• Cartridge/Syringe: 100 g or 30 cc available.
• Label Information: Alloy type (Sn98.5Ag1.0Cu0.5), Model (TS-506), Batch Number, Net Weight, Expiry Date.
• Shelf Life: 6 months from manufacture date when stored at 2°C – 10°C.

Safety & Handling (MSDS Highlights)

• Health: Flux fumes may irritate eyes and respiratory tract. Use adequate ventilation.
• Skin Contact: Wash immediately with soap and water.
• Storage: Keep away from strong oxidizers and acids.
• Disposal: Follow local regulations. Recycle if possible.

【Sn98.5Ag1.0Cu0.5 solder paste】 FAQ

Q1: Why choose Sn98.5Ag1.0Cu0.5 (SAC105) over standard SAC305 for my assembly?

A: While SAC305 (Sn96.5Ag3.0Cu0.5) offers higher thermal fatigue resistance, SAC105 like our TS-506 provides lower cost and better wetting on certain finishes, especially OSP. It also reduces intermetallic compound growth at the joint interface, which can be beneficial for boards with thinner copper traces. For consumer electronics and standard industrial applications, SAC105 delivers a superior balance of reliability and process yield, particularly when combined with our optimized flux that suppresses voiding.

Q2: How do I confirm this paste is compatible with my existing reflow oven?

A: The TS-506 is designed with a wide process window to accommodate various oven types (IR, hot air, or vapor phase). Start by setting your peak temperature to 245°C and ensure the time above liquidus (221°C) stays between 60-90 seconds. If you observe excessive solder balls, reduce the preheat ramp rate. If you see poor wetting, increase the peak temperature by 5°C. We recommend running a test board with a thermocouple attached to verify the profile matches our recommendations. The flux system is active in both air and nitrogen environments.

Q3: What quality documentation does TENSAN provide with each batch?

A: Every shipment of TS-506 【Sn98.5Ag1.0Cu0.5 solder paste】 includes a Certificate of Analysis (CoA) detailing:

• Alloy verification and flux content.
• Viscosity measurement at 25°C.
• Powder particle size distribution.
• SIR and copper mirror test results.

We also provide the full Material Safety Data Sheet (MSDS) upon request. All tests are performed in accordance with JIS.Z.3284 and IPC-TM-650 standards, ensuring full traceability from raw material to finished product.

Why Choose TENSAN as Your Supplier?

TENSAN operates a modern facility in the Tien Son Industrial Park, Bac Ninh, Vietnam—strategically located for quick delivery across Southeast Asia. As a vertically integrated manufacturer, we control the entire production chain, from alloy mixing to flux formulation. This ensures consistent quality and competitive pricing. Our team provides direct technical support to help you optimize your SMT process.

Contact Information:

Address: TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam

Phone: +84-222-650-8818

Email: mark@sztensan.com