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Sn98.5Ag1.0Cu0.5 solder paste Manufacturers

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Sn98.5Ag1.0Cu0.5 solder paste, Our R&D department always designs with new fashion ideas so we could introduce up-to-date fashion styles every month. Our strict production management systems always ensure stable and high quality goods. Our trade team provides timely and efficient services. If there are any interest and inquiry about our products, you should contact us in time. We would like to establish a business relationship with your honored company.

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  • Automatic Solder Paste Mixer

    Automatic Solder Paste Mixer

    TENSAN TS‑503 is a lead‑free, no‑clean solder paste designed for medium‑temperature reflow processes.
  • Lead-Free Solder Paste with Stable Printing & Fine Soldering

    Lead-Free Solder Paste with Stable Printing & Fine Soldering

    This product is ROHS, REACH compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
  • Automatic SMT Stencil Printer Solder Paste Printing

    Automatic SMT Stencil Printer Solder Paste Printing

    TS-350 is a lead-free no-clean high-performance solder paste compatible with all types of SMT printers, suitable for general assembly and ultra-fine pitch processes down to 0.28mm, and supports PiH paste-in-hole technology for complex components like BGA and QFN. It features stable printability, superior wetting, low void rate and excellent HiP resistance with a wide reflow window for air and nitrogen reflow environments. Low transparent non-conductive residues allow direct ICT testing without cleaning. RoHS-compliant with consistent lot-to-lot performance, it serves consumer, automotive, industrial, medical and telecom electronics, boosting first-pass yield and cutting rework & downtime costs.
  • No-Clean Solder Paste

    No-Clean Solder Paste

    In modern SMT assembly, the choice of solder paste directly impacts production efficiency, component reliability, and long‑term product performance. TENSAN TS‑503 is a No-Clean Solder Paste engineered specifically for medium‑temperature reflow processes, offering the ideal balance between thermal protection and soldering performance. This advanced solder paste formulation features a unique Sn‑Ag0.3‑Bi35 alloy, delivering a significantly lower melting point than conventional SAC305 pastes while maintaining excellent wettability and joint reliability. As a true No-Clean Solder Paste, TS‑503 eliminates post‑reflow cleaning, reduces process costs, and ensures high electrical reliability – making it the preferred solder paste for LED lighting, flexible circuits, and heat‑sensitive component assemblies.
  • Lead-Free High-Temperature Solder Paste

    Lead-Free High-Temperature Solder Paste

    TS-350-1 is a lead-free high-temperature solder paste. This SnAgCu Solder Paste utilizes the Sn96.5Ag3Cu0.5 (SAC305) alloy system with a melting point of 221–227°C, specifically designed for high-reliability electronic assembly. TS-350-1 is precision-engineered with Solder Paste Type 4 (20–38μm) spherical solder powder and Solder Flux, delivering excellent printing performance and extended stencil life on the Solder Paste Printer. Prior to use, thorough mixing via a Solder Paste Mixer is recommended to ensure uniform Solder Paste Composition. This Solder Paste Lead Free product has been widely adopted in high-temperature soldering applications including telecom base stations, server motherboards, automotive electronics, and industrial controls.
  • Lead-Free Solder Paste

    Lead-Free Solder Paste

    TENSAN TS‑501 is a Lead-Free Solder Paste engineered to meet these demands. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste lead free solution offers a lower melting point than conventional SAC alloys, making it ideal for assemblies with thermal‑sensitive components, flexible PCBs, and step‑soldering processes. With Type‑4 powder, ROL1 flux classification, and no‑clean residue, TS‑501 is the lead-free solder paste that combines environmental responsibility with outstanding process performance.
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