TS505 is a high‑temperature, no‑clean SnAgCu solder paste formulated with the Sn99Ag0.3Cu0.7 (SAC0307) alloy. This SnAgCu solder paste delivers stable printability, excellent wetting, and low voiding across a wide range of SMT applications – from fine‑pitch consumer devices (0.4 mm) to telecom and automotive boards.
In the evolution of lead‑free electronics manufacturing, the SnAgCu alloy system has emerged as the dominant choice for surface‑mount soldering. Offering a compelling balance of melting temperature, mechanical strength, and wetting performance, SnAgCu solder paste has become the standard for everything from consumer gadgets to automotive control units. However, not all SnAgCu solder paste formulations deliver the same level of process stability and joint integrity – the flux chemistry, powder morphology, and rheological control distinguish premium products from commodity alternatives.
TS505 is a high‑temperature, no‑clean SnAgCu solder paste formulated with the Sn99Ag0.3Cu0.7 (SAC0307) alloy. This SnAgCu solder paste is engineered to provide exceptional printability, excellent wetting, and remarkably low voiding across a broad range of SMT applications. Whether you are assembling telecom base stations, automotive ECUs, or fine‑pitch consumer devices, TS505 delivers the reliability and consistency that modern production lines demand – all while meeting stringent environmental regulations.
What Makes This SnAgCu Solder Paste Exceptional?
A superior SnAgCu solder paste must harmonise multiple performance attributes: stable rheology over extended printing, aggressive yet controlled flux activity, minimal slump, and residue that remains benign and testable. TS505 achieves this balance through a meticulously designed SAC0307 alloy and a halogen‑controlled flux system (L1 level, 0.085% halogens) that activates progressively during reflow.
This SnAgCu solder paste offers a melting range of 217–218°C, placing it firmly within the high‑temperature lead‑free category. The alloy composition ensures consistent intermetallic formation and mechanical strength, while the flux vehicle is optimised to provide rapid oxide removal without leaving excessive or conductive residues. As a result, TS505 is a SnAgCu solder paste that you can trust for mission‑critical applications where every joint must pass stringent electrical and thermal tests.
Product Specifications
Alloy Composition
Alloy Physical Properties
Solder Paste Specification
Reflow Profile
Core Advantages of This SnAgCu Solder Paste
1. Wide Reflow Process Window – Adapting to Diverse Board Designs
TS505, as a versatile SnAgCu solder paste, offers a generous reflow window that accommodates boards of varying thermal masses and densities. The recommended reflow profile is as follows:
This SnAgCu solder paste supports both air and nitrogen reflow, providing flexibility for different production environments. The wide process window helps minimise common defects such as solder beads, bridging, and tombstoning, ensuring high first‑pass yields.
2. Superior Wettability and Solder Wicking
The flux system in TS505 is precisely calibrated for this SnAgCu solder paste, ensuring rapid oxide removal and excellent wetting on all common surface finishes – including ENIG, OSP, HASL, and immersion silver. Even on mildly oxidised pads, this SnAgCu solder paste produces bright, full fillets with consistent capillary climb, resulting in strong, reliable intermetallic formation that withstands thermal and mechanical stress.
3. Low Voiding – Critical for High‑Reliability Joints
Voiding remains a significant concern for large thermal‑mass components such as QFN, LGA, and thermal pads. TS505's flux chemistry is engineered to facilitate efficient gas escape during reflow, significantly reducing void fractions. This SnAgCu solder paste has been validated in demanding automotive and telecom applications where voiding below 25% is a strict requirement, ensuring optimal thermal and electrical performance.
4. Outstanding Printability and Stencil Life
TS505 exhibits excellent rollability and thixotropic recovery, ensuring consistent paste transfer on automated printing lines. This SnAgCu solder paste maintains stable viscosity throughout extended production runs, reducing the need for frequent parameter adjustments. The paste resists drying on the stencil, which extends cleaning intervals and maximises uptime. Even on fine‑pitch pads down to 0.4 mm, this SnAgCu solder paste delivers precise, well‑defined deposits.
5. Minimal Residue and High Insulation Resistance
After reflow, TS505 leaves a dry, translucent residue that is non‑conductive and probe‑friendly – a critical attribute for any SnAgCu solder paste used in no‑clean processes. The residue passes stringent Surface Insulation Resistance (SIR) tests:
These properties make TS505 a SnAgCu solder paste that supports reliable ICT probing without cleaning, reducing process steps and associated costs while ensuring long‑term electrical reliability.
Typical Applications for This SnAgCu Solder Paste
TS505 is a versatile SnAgCu solder paste that excels in:
Frequently Asked Questions
Q: What distinguishes TS505 from other SnAgCu solder paste products?
A: TS505 is a SnAgCu solder paste that combines SAC0307 alloy with a low‑halogen, no‑clean flux system optimised for wide process windows, low voiding, and excellent print stability.
Q: Can this SnAgCu solder paste be used in both air and nitrogen reflow?
A: Yes, TS505 is designed for use in both atmospheres, offering excellent wetting and low voiding in either condition.
Q: What stencil type works best with TS505 SnAgCu solder paste?
A: Laser‑cut stainless steel stencils with electro‑polished apertures are recommended for optimal release and deposit fidelity with this SnAgCu solder paste.
Q: Does TS505 support paste‑in‑hole (PiH) applications?
A: Yes, its stable rheology and flux activity make TS505 suitable for PiH processes, further extending the versatility of this SnAgCu solder paste.
Q: How long can this SnAgCu solder paste remain on the stencil during production?
A: Under standard shop‑floor conditions (20–25°C, RH <65%), TS505 maintains its print performance throughout a typical shift, reducing downtime and improving productivity.
Package and Shipping
Each 500g bottle of this SnAgCu solder paste is packed in wide‑mouth plastic (PE) containers with an inner seal to preserve freshness. Bottles are shipped in foam‑lined boxes, with a maximum of 20 bottles per box, ensuring internal temperatures remain below 35°C during transit.
Quality Assurance – Consistency You Can Rely On
Every batch of TS505 is subjected to rigorous quality control, with a Certificate of Analysis provided to verify:
Our quality system ensures that every shipment of this SnAgCu solder paste delivers identical performance, giving you the confidence to run high‑volume production without unexpected process variation.
Conclusion
Selecting the right SnAgCu solder paste is a strategic decision that influences every stage of SMT assembly – from printing to reflow to final test. TS505 offers a proven combination of wide process window, excellent wetting, low voiding, minimal residue, and outstanding printability. It is a SnAgCu solder paste that bridges the gap between stringent environmental mandates and the demanding performance requirements of modern electronics.
By choosing TS505, manufacturers can achieve:
For those seeking a robust, high‑quality SnAgCu solder paste that performs reliably in both standard and challenging environments, TS505 is the trusted solution.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
For inquiries about alternative alloys, custom powder sizes, or specific formulations of SnAgCu solder paste, please contact your local Tensan sales representative.
