snagcu solder paste Manufacturers

2.5W/mK thermal grease: high conductivity for power supplies & lighting. It’s engineered to handle continuous operation, reduces heat buildup, and is durable in harsh environments. A top pick for industrial electronics.

TS107E is a widely used no‑clean, leaded solder paste that is specifically formulated to minimise head‑in‑pillow defects in BGA and CSP soldering. As a Low Head‑in‑Pillow Defect Solder Paste, it delivers outstanding Head‑in‑pillow defect resistance, making it the ideal choice for assemblies where PCB warpage, component coplanarity variations, and thermal mismatch are critical concerns. Beyond its exceptional defect prevention, TS107E also provides excellent ultra‑fine pitch printing capability, high in‑circuit probe test yield, and long‑term reliability, ensuring robust performance in demanding electronic manufacturing environments.

Soft Silicone Type Thermal Mat/Thermal Pad for Electronics of Thermal Pad LED lighting,lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply.

White RTV silicone sealant specifically designed for outdoor lighting, featuring a pure white matte finish that complements various white lamp housings. After curing, the pure white sealant provides a clean appearance, strong coverage, and enhances the aesthetics of the lamp's internal structure. It boasts excellent waterproof and moisture-proof properties, effectively preventing moisture from corroding the LED chips and circuitry. Curing at room temperature without solvents, it is environmentally friendly and safe, and compatible with automated dispensing processes. Weather-resistant and anti-aging, it will not crack or peel off when used in outdoor streetlights and garden lights.

Low Void High Reliability Solder Paste for QFN & LGA – TENSAN TS‑506 is a lead‑free, no‑clean solder paste formulated specifically to address these challenges. With its Sn98.5Ag1.0Cu0.5 alloy and advanced flux chemistry, TS‑506 delivers exceptional void reduction, strong wetting, and stable printing—making it the trusted choice for high‑reliability SMT assemblies.

As a leading solution in low‑temperature soldering, Low‑Temperature Solder Paste (Sn42Bi58) combines a high‑reliability flux system with fine spherical Sn42/Bi58 alloy powder. This advanced Solder Paste is engineered to deliver exceptional printability, minimal residue, and robust electrical performance, making it an ideal choice for heat‑sensitive assemblies and high‑density interconnects. Its eutectic composition ensures a sharp melting point at 138 °C, enabling energy‑efficient reflow and protecting temperature‑critical components.