TS-350 is a lead-free, no-clean solder paste based on SAC305 alloy (Sn96.5Ag3Cu0.5), with a melting point of 221–227°C, Type 4 powder size (20–38 μm), flux content of 10.5±0.5%, viscosity of 220,000 mPa·s, and halogen content meeting L0 level. Key Advantages: Stable printing with excellent shape retention, supporting ultra-fine pitch down to 0.28mm; strong wetting performance, low voiding, minimal residue (~5%), compatible with air/nitrogen reflow; effective head-in-pillow (HiP) resistance for improved first-pass yield; fully RoHS compliant—helping you meet global environmental regulations with ease. Storage: Refrigerate at 2–10°C (do not freeze), 6-month shelf life. Allow 4+ hours of sealed warm-up before use, followed by 1–2 minutes of mixing. Applications: Consumer electronics, automotive electronics, industrial controls, telecommunications, medical devices, LED lighting.
Why Choose Lead-Free Solder Paste?
In today's electronics manufacturing landscape, the shift to lead-free assembly is no longer an option—it is a global regulatory and market imperative. As a solder paste lead free solution, TS-350 is engineered to deliver the same level of printability, wetting performance, and reliability that manufacturers have long depended on from traditional tin-lead formulations, while fully complying with environmental directives and meeting the rigorous demands of modern SMT production.
In the fast-paced world of electronics manufacturing, every production line faces the same critical challenges: achieving consistent print quality, minimizing defects, and maintaining high first-pass yields. As component geometries shrink and PCB designs grow more complex, the solder paste lead free formulation you choose directly determines your production efficiency and product reliability.
High-performance solder paste featuring outstanding printability and superior wetting performance is precisely what TS-350 delivers—a lead-free, no-clean solder paste engineered specifically for manufacturers demanding ultra-fine pitch capability without compromising on soldering quality. As a proven solder paste lead free product, TS-350 bridges the performance gap between legacy tin-lead processes and today's environmentally responsible assembly requirements.
Whether you're running high-volume production or specialized rework operations, TS-350 provides the stability, consistency, and wetting characteristics that today's SMT assembly lines require. This solder paste lead free formulation ensures that your production remains compliant with RoHS and other global environmental standards while delivering the robust soldering performance needed for mission-critical electronics.
The Unique Value of TS-350 Lead-Free Solder Paste
What Makes TS-350 a High-performance solder paste featuring outstanding printability and superior wetting performance?
TS-350 is a widely adopted no-clean solder paste formulated to bridge the gap between tin-lead and lead-free processes. As a solder paste lead free solution, its balanced chemistry ensures stable printing over extended production runs while delivering the wetting performance needed for reliable solder joints—without the environmental liabilities associated with lead-containing materials.
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 combines advanced rheology with robust flux activation, making it suitable for both standard SMT assembly and demanding applications such as QFN, BGA, and ultra-fine pitch components down to 11 mil (0.28mm) square pads. This solder paste lead free formulation is specifically optimized to overcome the higher melting point and reduced wetting speed typically associated with lead-free alloys, ensuring that your transition to lead-free does not come at the cost of quality or productivity.
Product Specifications
Alloy Composition
Physical & Electrical Properties
Core Features and Benefits
1. Outstanding Print PerformanceTS-350 delivers High-performance solder paste featuring outstanding printability and superior wetting performance consistently across long production runs, as a solder paste lead free formulation that maintains its rheological stability even under demanding production conditions.
2. Superior Wetting and Soldering Quality
Wetting performance directly affects joint reliability. For a solder paste lead free product, achieving rapid and complete wetting is particularly challenging due to the higher surface tension of lead-free alloys. TS-350's flux chemistry is specifically formulated to overcome this challenge, ensuring rapid and complete wetting on various surface finishes.
3. Minimal Residue and Clean Solder Joints
4. Excellent Head-in-Pillow (HiP) Resistance
QFN and BGA assemblies are susceptible to head-in-pillow defects. This solder paste lead free formulation is specifically formulated to resist this failure mode, improving first-pass yields on in-line testing.
5. RoHS Compliance
As a fully compliant solder paste lead free product, TS-350 meets RoHS Directive 2002/95/EC, ensuring regulatory compliance for electronics exports to global markets and giving manufacturers peace of mind in an increasingly regulated environment.
Storage and Handling Guidelines
Storage Conditions
Handling Procedure
Recommended temperature
Safety Considerations
Quality Assurance
Each batch of TS-350 is accompanied by a Certificate of Analysis covering:
Typical Applications
TS-350 is designed for:
|
Application Area |
Specific Products |
|
Consumer ElectronicsConsumer Electronics |
Smartphones, tablets, wearables |
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Automotive Electronics |
ECUs, sensors, lighting modules |
|
Industrial Controls |
PLCs, power supplies, drives |
|
Telecommunications |
Base stations, routers, RF modules |
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Medical Devices |
Diagnostic equipment, monitors |
|
LED Lighting |
High-density PCB assemblies |
Frequently Asked Questions
Q1: Can TS-350 be used for both standard-pitch and ultra-fine-pitch printing?
A: Yes. High-performance solder paste featuring outstanding printability and superior wetting performance is formulated to perform equally well on standard 0.5 mm pitch and ultra-fine 0.25 mm (10 mil) pitch applications. As a solder paste lead free product, TS-350 demonstrates that lead-free does not mean compromising on fine-pitch capability.
Q2: What stencil type is recommended for TS-350?
A: ALPHA® Stencils or equivalent high-quality laser-cut stainless steel stencils are recommended for optimal release and shape retention.
Q3: Does TS-350 support paste-in-hole (PiH) applications?
A: Yes, TS-350 is suitable for paste-in-hole processes.
Q4: How long can TS-350 remain on the stencil during production?
A: With its stable viscosity and excellent stencil life, TS-350 maintains print performance throughout typical production shifts. Always reseal unused paste to maximize its usable life.
Q5: Why choose a solder paste lead free product like TS-350 over traditional tin-lead paste?
A: TS-350 offers the ideal balance of environmental compliance and soldering performance. Unlike many lead-free pastes that struggle with wetting speed or voiding, TS-350 delivers joint quality comparable to tin-lead while fully meeting RoHS requirements. This makes it the preferred solder paste lead free choice for manufacturers who refuse to compromise on quality or regulatory compliance.
Conclusion
Choosing the right solder paste is one of the most critical decisions in SMT assembly. For manufacturers navigating the transition from tin-lead to environmentally responsible production, selecting a high-performance solder paste lead free product is essential. TS-350 delivers everything you need: consistent printing, superior wetting, minimal residue, and proven reliability across a wide range of applications. As a solder paste lead free solution, it eliminates the environmental and regulatory risks of lead-containing materials while delivering the robust soldering performance that modern electronics demand.
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 helps you achieve:
For manufacturers seeking a stable, high-quality solder paste lead free solution that bridges the gap between tin-lead legacy processes and today's demanding lead-free requirements, TS-350 is the proven choice. Our technical team is available to support your lead-free transition with process recommendations, profile optimization, and application assistance to ensure that your move to solder paste lead free is seamless and successful.
Contact InformationTENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84-222-650-8818
Email: mark@sztensan.com
For inquiries regarding alternative alloys, custom packaging, or solder paste lead free process optimization and transition support, please contact your local Tensan sales office.
