Ultra Fine Pitch Printing Solder Paste

TS107E is a widely used no‑clean, leaded solder paste that is specifically engineered to deliver exceptional printing performance at the most demanding fine‑pitch geometries. As an Ultra‑Fine Pitch Printing Solder Paste, it offers industry‑leading Ultra‑fine pitch printing capability, achieving repeatable deposits down to 200μm (8mil) apertures on stencil thicknesses as low as 100μm (4mil). Beyond its outstanding printability, TS107E also provides low head‑in‑pillow defects, high in‑circuit probe test yield, and IPC Class III voiding performance, making it the ideal choice for high‑density, high‑throughput electronic manufacturing.

Solder Paste Composition

TS107E Ultra‑Fine Pitch Printing Solder Paste consists of Sn63/Pb37 alloy powder and solder flux. According to the technical datasheet, this product uses the Sn63/Pb37 eutectic alloy (63% tin, 37% lead) with a melting point of 183°C. The flux content is approximately 5% (by weight), utilising an ROL0‑grade activator system (the highest reliability level per IPC J‑STD‑004). This formulation is carefully optimised to provide stable rheology and consistent transfer efficiency – critical enablers for achieving superior Ultra‑fine pitch printing – while ensuring minimal residue and reliable solder joints.

Solder Paste Type – Customisable Powder Size Options

TS107E Ultra‑Fine Pitch Printing Solder Paste is available in a wide range of powder sizes to suit different printing and dispensing needs, with the finest powder types specifically optimised for Ultra‑fine pitch printing. The product family offers the industry’s broadest selection of Solder Paste Type options, including:

Among these, Type 4.5 and Type 5 are specifically formulated to maximise Ultra‑fine pitch printing performance. Their proprietary particle size distributions and precisely controlled metal content ensure excellent transfer efficiency and shape retention, even on the smallest apertures and thinnest stencils.

Sn63/Pb37 Alloy Advantages

As a typical Ultra‑Fine Pitch Printing Solder Paste, TS107E utilises the Sn63/Pb37 eutectic alloy, offering the following core benefits:

• Eutectic characteristics – melting point of 183°C, no plastic zone, rapid solidification during soldering, reducing cold solder risks and ensuring sharp, well‑defined joints after reflow;
• Mature technology – Sn63/Pb37 is the most widely applied alloy system, and its predictable wetting and coalescence behaviour supports Ultra‑fine pitch printing by enabling complete coalescence even on minute deposits;
• Superior wettability – excellent performance across various PCB surface finishes, especially on CuOSP, promoting reliable joint formation on fine‑pitch pads;
• Cost‑effectiveness – compared to lead‑free alloys, this product offers competitive material costs while delivering outstanding printing resolution.

This alloy system, combined with the optimised flux and powder size distribution, ensures that TS107E achieves consistent, defect‑free prints at the most aggressive fine‑pitch geometries.

Flux and Electrical Reliability

The flux in TS107E employs an ROL0‑grade activator system (IPC J‑STD‑004 highest reliability level) and is halogen‑containing (confirmed by titration and silver halide tests). This flux system ensures that the Ultra‑Fine Pitch Printing Solder Paste passes all of the following tests, while also providing the rheological stability essential for Ultra‑fine pitch printing:

These results confirm that the flux residue is electrically safe and reliable, while the flux chemistry itself is key to enabling Ultra‑fine pitch printing – the activator system and solvent blend provide the ideal viscosity profile and tackiness for clean aperture release and stable deposit shapes over long print runs.

Printing Performance and Process Parameters

TS107E Ultra‑Fine Pitch Printing Solder Paste demonstrates outstanding printing consistency and high process capability index (Cpk) on the printer, especially at the most demanding fine‑pitch settings. The key printing parameters for this product are:

• Printing speed: 25–150mm/s (1–6 in/s), supporting high‑speed printing for fast cycle times and high throughput – remarkable stability even at maximum speed;
• Squeegee pressure: 0.18–0.27kg/cm (1.0–1.5lbs/inch); higher speeds require increased pressure to ensure optimal paste roll and aperture filling;
• Squeegee angle: 60° (standard);
• Squeegee material: metal or polyurethane rubber (hardness 80–90 Shore);
• Stencil thickness: 100–150μm (4–6mil) – compatible with ultra‑thin stencils down to 100μm;
• Stencil separation speed: 3–10mm/s – adjustable to suit fine‑pitch requirements;
• Stencil material: recommended Alpha series electroformed/laser‑cut stencils for optimal aperture wall finish.

This product exhibits minimal viscosity variation during continuous printing at 25°C/50%RH, significantly reducing cleaning frequency and improving production line efficiency. Its stable rheology and controlled slump ensure that Ultra‑fine pitch printing remains accurate and repeatable, with no bridging or insufficient paste volume, even after extended print cycles.

Handling and Process Guidelines

TS107E Ultra‑Fine Pitch Printing Solder Paste must be stored refrigerated at 0–10°C (shelf life: 6 months). Prior to use, the paste should be allowed to warm to room temperature for approximately 4 hours (ensure temperature ≥19°C before opening), and then mixed:

• Manual mixing: can be stirred with a spatula until uniform;
• Centrifugal mixer (solder paste mixer): recommended speed below 300 RPM, with a pause after every 30–60 seconds of mixing;
• Important: Never mix solder paste recovered from the stencil with unused paste in the same container, as this will alter the rheological properties of the unused Ultra‑Fine Pitch Printing Solder Paste.

After printing, reflow should be completed as soon as possible. The reflow profile recommends a peak temperature of 210–220°C (above the 183°C melting point), and can be performed in air or nitrogen atmospheres. Following these guidelines helps preserve the product’s Ultra‑fine pitch printing characteristics, ensuring consistent aperture release and deposit geometry.

Core Differentiating Advantages – Superior Printing and More

TS107E Ultra‑Fine Pitch Printing Solder Paste offers three industry‑leading advantages:

• Exceptional Ultra‑fine pitch printing – This product is engineered to deliver the highest level of Ultra‑fine pitch printing performance available for leaded solder pastes. It consistently achieves complete, defect‑free aperture filling on 200μm (8mil) round apertures with 100μm (4mil) stencil thickness, and supports printing speeds up to 150mm/s with high Cpk values. This capability enables manufacturers to produce high‑density assemblies with fine‑pitch QFPs, BGAs, and CSPs while maintaining high throughput and yield.
• Low head‑in‑pillow defect rate – While the primary focus is on printing, TS107E also provides outstanding resistance to head‑in‑pillow defects in BGA/CSP soldering, reducing open defects caused by PCB warpage and component coplanarity issues – ensuring that the fine‑pitch joints are not only well‑printed but also electrically sound.
• Excellent probe testability and low voiding – TS107E provides best‑in‑class in‑circuit probe test yield and meets IPC 7095 Class III voiding performance (the highest level). 

These complementary benefits ensure that fine‑pitch assemblies are not only printable but also testable and reliable over the product lifetime.

Application Scenarios and Supply Capacity

TS107E Ultra‑Fine Pitch Printing Solder Paste has been deployed in volume production across the following sectors, where its Ultra‑fine pitch printing capability delivers tangible quality and yield improvements:

This Ultra‑Fine Pitch Printing Solder Paste serves over 50 customers, with a monthly production capacity exceeding 3 tonnes and ample inventory, enabling delivery within 48 hours.