Ultrafine pitch printing Manufacturers

With our abundant experience and considerate products and services, we have been recognized to be a reputable supplier for a lot of global consumers for Ultrafine pitch printing, We have been wanting forwards to creating long-term company interactions with around the world shoppers.
Ultrafine pitch printing, we've been sincerely hope to establish one good long term business relationship with your esteemed company thought this opportunity, based on equal, mutual beneficial and win win business from now till the future.

Hot Products

  • Solder Paste Material

    Solder Paste Material

    TS-503 is a lead-free medium-temperature solder paste developed by TENSAN, utilizing the Sn-Ag0.3-Bi35 (Tin-Silver-Bismuth) alloy system with a melting point of approximately 140°C. It is specifically designed for SMT assembly of heat-sensitive components and multi-layer PCBs. This product is precision-engineered with Type 4 (20–38μm) spherical solder powder and an ROL1-grade low-halogen flux system, delivering excellent printability, superior wettability, and high-reliability electrical performance. It is an ideal choice for consumer electronics, LED lighting, automotive electronics, and other related industries.
  • Type 3 Low-Temperature Solder Paste

    Type 3 Low-Temperature Solder Paste

    As a fully compliant solution for environmentally conscious electronics manufacturing, Type 3 Low‑Temperature Solder Paste combines a high‑reliability flux system with fine spherical Sn42/Bi58 alloy powder. This advanced Solder paste type 3 / type 4 product is engineered to deliver exceptional printability, minimal residue, and robust electrical performance – all while meeting the strictest global restrictions on hazardous substances. Its eutectic composition provides a sharp melting point at 138 °C, enabling energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm, this paste bridges the gap between Type 3 and Type 4 classifications, making it the ideal Solder paste type 3 / type 4 choice for both conventional and fine‑pitch SMT assembly lines.
  • High Temp Resistance Thermal Conductive Silicone Pad Silicone Mat

    High Temp Resistance Thermal Conductive Silicone Pad Silicone Mat

    Typical applications of Thermal Pad lies in High Temp Resistance Thermal Conductive Silicone Pad Silicone Mat LED lighting, lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply
  • High‑Performance Lead‑Free No‑Clean Solder Paste for Fine‑Pitch and High‑Reliability SMT Assembly

    High‑Performance Lead‑Free No‑Clean Solder Paste for Fine‑Pitch and High‑Reliability SMT Assembly

    TS505 is a high‑temperature, lead‑free, no‑clean solder paste built around a carefully engineered solder paste composition. It features the Sn99Ag0.3Cu0.7 (SAC0307) alloy, Type 4 powder (20–38 µm), a flux content of 10.5 ± 0.5 %, and a halogen‑controlled flux system (L1 level, 0.085 % halogens). This precise solder paste composition provides a wide reflow window, excellent wetting on all common board finishes, extremely low voiding, minimal non‑conductive residue, and consistent print stability over long production runs. Whether you assemble telecom infrastructure, automotive ECUs, or consumer wearables, TS505’s solder paste composition delivers the robustness and predictability that modern SMT lines demand.
  • TS1009 High Efficiency Thermal Paste 3.5W/mK for PC CPU/GPU - Ideal for Gaming & Design

    TS1009 High Efficiency Thermal Paste 3.5W/mK for PC CPU/GPU - Ideal for Gaming & Design

    3.5W/mK insulated thermal paste: top cooling for GPUs & processors. It offers both strong heat transfer and insulation, resists thermal breakdown, and works in tight component spaces. Perfect for high-power electronics.
  • TS704 Precision Electronics Bonding Solution - White Semi-Flow RTV Silicone , Self-Levelling & Thin Layer,  Waterproof,  High Temp Resistant

    TS704 Precision Electronics Bonding Solution - White Semi-Flow RTV Silicone , Self-Levelling & Thin Layer, Waterproof, High Temp Resistant

    Precision bonding demands precision materials. This white RTV silicone features: Self-Levelling Flow for bubble-free, uniform thin films. Dust/water resistance and maintains adhesion and elasticity across a wide temperature range.

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