TENSAN water‑soluble solder paste is engineered for SMT assembly processes that demand the highest levels of cleanliness and reliability. Formulated with advanced water‑soluble flux chemistry, this Water‑Soluble Solder Paste delivers excellent wetting, low voiding, and stable printability – while ensuring that all flux residues are easily washed away in aqueous cleaning systems. Available in multiple alloy options and solder paste type classifications, TENSAN water‑soluble solder paste provides the performance and cleanliness that mission‑critical applications require.
In high‑reliability electronics assembly, post‑soldering cleanliness is often as critical as the soldering process itself. For applications where even trace ionic residues cannot be tolerated – such as medical devices, aerospace systems, automotive safety modules, and telecommunications infrastructure – a water‑soluble solder paste offers the definitive solution. Unlike no‑clean pastes that leave residues behind, water‑soluble formulations are designed to be completely removed with deionised water, leaving boards pristine and free from contamination.
TENSAN water‑soluble solder paste is engineered for SMT assembly processes that demand the highest levels of cleanliness and reliability. Formulated with advanced water‑soluble flux chemistry, this Water‑Soluble Solder Paste delivers excellent wetting, low voiding, and stable printability – while ensuring that all flux residues are easily washed away in aqueous cleaning systems. Available in multiple alloy options and solder paste type classifications, TENSAN water‑soluble solder paste provides the performance and cleanliness that mission‑critical applications require.
What Is TENSAN Water-Soluble Solder Paste?
TENSAN water‑soluble solder paste is a lead‑free, water‑washable formulation designed for SMT assembly processes that require:
This Water‑Soluble Solder Paste is the preferred choice for manufacturers who cannot compromise on board cleanliness – where post‑reflow washing is not an option but a requirement.
Key SpecificationsAlloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Why Choose TENSAN Water-Soluble Solder Paste?
1. Superior Cleanliness – Zero Residue Risk
The defining characteristic of a water‑soluble solder paste is its ability to be completely removed after reflow. TENSAN water‑soluble flux residues are highly soluble in deionised water, allowing thorough cleaning in both batch and in‑line aqueous cleaning systems. This eliminates the risk of ionic contamination, dendrite growth, and leakage current – failures that can plague no‑clean assemblies in high‑humidity environments. For applications where long‑term reliability is paramount, this Water‑Soluble Solder Paste provides the cleanest possible board surface.
2. High Reliability – Trusted for Mission‑Critical Applications
Water‑soluble solder paste is the standard for industries where failure is not an option. TENSAN water‑soluble formulations are used in:
In these applications, the complete removal of flux residues ensures that no ionic migration or corrosion can occur over the product’s lifetime. This solder paste type is specifically chosen for its cleanability and reliability.
3. Excellent Printability – Compatible with Multiple Solder Paste Types
TENSAN water‑soluble solder paste is available in various powder sizes to suit different printing requirements. Whether you need Type 4 solder paste (20–38 μm) for standard fine‑pitch applications, or finer solder paste type classifications such as Type 5 or Type 6 for ultra‑fine pitch and 008004 component placement, TENSAN offers the right solder paste type for your process. The paste delivers:
4. Low Voiding – Reliable Thermal and Mechanical Joints
Voiding in solder joints reduces thermal conductivity and mechanical strength. TENSAN water‑soluble solder paste is formulated to minimise gas entrapment during reflow, achieving low voiding rates even on large thermal pads. This ensures that heat is efficiently conducted away from power components, extending product life and reliability.
5. Wide Process Window – Adapts to Your Production
TENSAN water‑soluble solder paste offers a broad processing window:
This flexibility makes it suitable for a wide range of SMT production environments, from high‑volume consumer lines to low‑volume, high‑mix aerospace assemblies.
6. Easy Cleaning – Reduced Process Costs
Unlike some water‑soluble pastes that require aggressive cleaning chemistries, TENSAN water‑soluble residues are easily removed with deionised water alone. This simplifies the cleaning process, reduces chemical costs, and minimises environmental impact. The high solubility of the residues ensures that even fine‑pitch, low‑standoff components are thoroughly cleaned.
Recommended Application Parameters
Stencil Design Guidelines
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics for all solder paste type classifications.
Printing Conditions
Reflow Profile (Recommended)
For water‑soluble solder paste, RTS (Ramp‑to‑Soak) profiles are often preferred to preserve flux activity before reflow. The specific profile should be optimised based on your alloy choice, board design, and reflow oven.
Storage and Handling Guidelines
Important: Always warm up this solder paste in its sealed container to prevent moisture condensation. Water‑soluble solder paste is more sensitive to humidity than no‑clean formulations – maintain proper environmental controls in the printing area.
Alloy Composition Overview
Typical Applications for Water-Soluble Solder Paste
TENSAN water‑soluble solder paste is ideal for applications where post‑reflow cleanliness is mandatory:
In all these applications, the ability to completely remove flux residues ensures long‑term reliability and compliance with stringent industry standards.
Quality Assurance
Every batch of TENSAN water‑soluble solder paste is accompanied by a Certificate of Analysis confirming:
Our rigorous quality control ensures consistent product quality from lot to lot, giving you confidence in every production run.
Frequently Asked Questions
Q: What is the difference between water‑soluble and no‑clean solder paste?
A: Water‑soluble solder paste uses flux chemistry that is designed to be completely removed with deionised water after reflow, leaving no ionic residues. No‑clean pastes leave a residue that is intended to remain on the board. Water‑soluble is preferred for high‑reliability applications where cleanliness is critical.
Q: What solder paste type is recommended for fine‑pitch printing?
A: For standard fine‑pitch (0.4–0.5 mm), Type 4 solder paste (20–38 μm) is recommended. For ultra‑fine pitch (0.3 mm and below), a finer solder paste type such as Type 5 or Type 6 is required. TENSAN offers multiple solder paste type options to suit your application.
Q: Is water‑soluble solder paste more difficult to print than no‑clean?
A: With proper process control, water‑soluble solder paste prints as well as no‑clean formulations. TENSAN water‑soluble pastes are engineered for stable rheology, long stencil life (>8 hours), and excellent release characteristics across all solder paste type classifications.
Q: Do I need special cleaning equipment for water‑soluble solder paste?
A: Standard batch or in‑line aqueous cleaning systems are sufficient. Deionised water is the primary cleaning medium, though warm water (50–65°C) improves cleaning efficiency. No aggressive solvents are required.
Q: What is the shelf life of water‑soluble solder paste?
A: Six months from production date when stored at 2–10°C. Water‑soluble solder paste should be used promptly after opening – do not store opened containers for extended periods.
Q: Can water‑soluble solder paste be used in nitrogen reflow?
A: Yes, it performs well in both air and nitrogen environments. Nitrogen can further improve wetting on difficult surface finishes.
Q: What industries typically use water‑soluble solder paste?
A: Medical, aerospace, automotive safety, telecommunications infrastructure, and any application where ionic cleanliness is critical for long‑term reliability.
Conclusion
For manufacturers who demand the highest levels of board cleanliness and long‑term reliability, TENSAN water‑soluble solder paste is the definitive solution. This Water‑Soluble Solder Paste offers complete residue removal with deionised water, excellent printability across multiple solder paste type classifications, low voiding, and stable process performance – all backed by rigorous quality assurance.
By choosing TENSAN water‑soluble solder paste, you select a solder paste that:
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
