Solder paste type Manufacturers

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Solder paste type, We care about every steps of our services, from factory selection, product development & design, price negotiation, inspection, shipping to aftermarket. We have implemented a strict and complete quality control system, which ensures that each product can meet quality requirements of customers. Besides, all of our products have been strictly inspected before shipment. Your Success, Our Glory: Our aim is to help customers realize their goals. We are making great efforts to achieve this win-win situation and sincerely welcome you to join us.

Hot Products

  • TS1002 Easy-to-Apply Thermal Grease for LED Lights 1.5W/(m·K) - Reliable Daily Cooling

    TS1002 Easy-to-Apply Thermal Grease for LED Lights 1.5W/(m·K) - Reliable Daily Cooling

    This 1.5W/mK cost-effective paste cools laptop CPUs & LED lighting efficiently. It fills surface irregularities to speed up heat transfer, is safe for sensitive components, and is easy to reapply. A smart pick for home users or small businesses.
  • Low-Ionic Activator System

    Low-Ionic Activator System

    As a fully compliant solution for environmentally conscious electronics assembly, Low‑Ionic Activator System is a high‑performance Solder flux formulated specifically for Sn42/Bi58 eutectic solder pastes. This advanced Solder flux combines a low‑ionic activator with a carefully balanced resin and solvent system, delivering exceptional printability, minimal residue, and robust electrical reliability – all while meeting the strictest global restrictions on hazardous substances. When used with SnBi alloy powder, this Solder flux enables a sharp melting point at 138 °C, supporting energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm (spanning Type 3 and Type 4), the Solder flux ensures excellent stencil release and process stability across both conventional and fine‑pitch SMT lines.
  • Long-Lasting High Tackiness Solder Paste for Double-Sided Reflow

    Long-Lasting High Tackiness Solder Paste for Double-Sided Reflow

    TENSAN TS‑506 is a Long‑Lasting High Tackiness Solder Paste for Double‑Sided Reflow. Its advanced flux system is engineered to provide strong initial tack and retain that holding force for extended periods, even after the first reflow and during the second pass. With a balanced low‑silver alloy (Sn98.5Ag1.0Cu0.5), excellent printability, and low voiding, TS‑506 is the ideal high tackiness solder paste for double‑sided reflow for manufacturers seeking reliability and productivity.
  • Fine-Pitch Solder Paste

    Fine-Pitch Solder Paste

    TENSAN TS‑503 is a Fine-Pitch Solder Paste engineered specifically to meet these challenges. With its Type‑4 powder, optimised rheology, and unique Sn‑Ag0.3‑Bi35 alloy, this Solder paste type 4 product delivers exceptional print stability, clean stencil release, and reliable joint formation – making it the preferred Fine-Pitch Solder Paste for LED modules, smartphones, wearables, and other high‑density assemblies.
  • Solder Wire and Flux

    Solder Wire and Flux

    TS‑350 is a lead‑free, no‑clean solder paste built around a high‑performance solder flux that ensures outstanding printability and superior wetting. The flux chemistry delivers stable rheology for fine‑pitch printing (down to 0.25 mm / 10 mil), rapid oxide removal, and excellent wetting on all common surface finishes. It leaves a dry, non‑conductive residue (~5 % w/w) that passes SIR tests and supports in‑circuit testing without cleaning.
  • No-Clean Solder Flux

    No-Clean Solder Flux

    TENSAN offers two advanced no‑clean solder flux formulations through its TS‑506 and TS‑501 solder pastes. Each is engineered to address specific manufacturing requirements – from high‑reliability automotive and server applications to heat‑sensitive LED and flexible PCB assemblies. Both products feature advanced No‑Clean Solder Flux chemistry that delivers excellent wetting, low voiding, stable printing, and transparent, non‑conductive residues – all while eliminating cleaning steps and reducing production costs.

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