Thermally Conductive Encapsulant Manufacturers

We hold strengthening and perfecting our items and repair. At the same time, we get the job done actively to do research and progress for Thermally Conductive Encapsulant,Thermal conductivity potting,thermal conductive compounds,thermal potting,silicone thermal potting compound, We are going to do our greatest to satisfy or exceed customers' prerequisites with excellent goods, advanced concept, and economical and timely company. We welcome all clients.
Thermally Conductive Encapsulant, You can do one-stop shopping here. And customized orders are acceptable. Real business is to get win-win situation, if possible, we would like to deliver more support for customers. Welcome all nice buyers communicate details of products and solutions and ideas with us!!

Hot Products

  • SIlicone Gel

    SIlicone Gel

    TS8866 is a two-component addition-cured silicone gel, specially designed for the production of stress-relief toys. It can cure into a soft and sticky gel at room temperature, and the curing process can be accelerated by heating it to 40-50℃. The product is flexible and soft, meeting the needs of different customer groups and achieving a stress-relief effect.
  • TS1003 High-Efficiency Thermal Paste (Easy to Apply)  2.0W/mK for GPU & PCB Board Cooling

    TS1003 High-Efficiency Thermal Paste (Easy to Apply) 2.0W/mK for GPU & PCB Board Cooling

    Our 2.0W/mK thermal paste is easy to apply—perfect for GPUs & PCB boards. It has a smooth, non-runny texture, fills micro-gaps quickly, and boosts heat transfer for mid-range components. Ideal for DIY builds or professional maintenance.
  • TS1008  High-Performance Thermal Paste 3.0W/mK for PC CPU Coolers & High Bay Light Cooling

    TS1008 High-Performance Thermal Paste 3.0W/mK for PC CPU Coolers & High Bay Light Cooling

    3.0W/mK thermal paste: top-tier cooling for PC CPU coolers & high bay lights. It handles intense heat, fills micro-gaps completely, and boosts heatsink performance. Ideal for overclockers or commercial lighting setups.
  • TS8800 Economical 1:1 Two-Part Silicone Potting Compound – Thermal Conductive Waterproof Encapsulant for LED Drivers, Bulk Price

    TS8800 Economical 1:1 Two-Part Silicone Potting Compound – Thermal Conductive Waterproof Encapsulant for LED Drivers, Bulk Price

    TS8800 Economic 1:1 Two-Component Silicone Potting Compound, specially developed for LED drivers and power modules, offers both thermal conductivity and waterproofing. It cures at room temperature, is easy to mix, requires no special equipment, and is suitable for both automated and manual operations. After curing, it is flexible and crack-resistant, effectively protecting electronic components from moisture and dust. It offers excellent value for money, supports bulk purchases at wholesale prices, meets the stable protection needs of mid-to-low-end products, free samples are available upon request, and factory direct supply ensures fast delivery.
  • TS8866 High Thermal Conductivity Potting Silicone 1.0 W/m·K – Waterproof Flame-Retardant Encapsulant for Power Converters & PCB

    TS8866 High Thermal Conductivity Potting Silicone 1.0 W/m·K – Waterproof Flame-Retardant Encapsulant for Power Converters & PCB

    TS8866 potting compound with 1.0 W/m・K high thermal conductivity, 1:1 two-component ratio, suitable for power converters, PCB boards, and LED driver packaging. It cures quickly at room temperature, has excellent flowability, and can fully fill tiny gaps to form a seamless protective layer. After curing, it is resistant to high and low temperatures and thermal shock, with stable thermal conductivity, accelerating heat dissipation and improving equipment stability; it is also waterproof and flame retardant, ensuring safe use. Free samples are available; direct factory sales for bulk orders, with preferential pricing for large quantities.
  • TS5505 High Thermal Conductive Silicone Sealant 1.0W/m·K , Fast Cure, Waterproof for General Electronics/LED Lighting, Factory Direct

    TS5505 High Thermal Conductive Silicone Sealant 1.0W/m·K , Fast Cure, Waterproof for General Electronics/LED Lighting, Factory Direct

    Simplify thermal interface needs: 1.0W/m·K adhesive offers reliable heat transfer for PCB assemblies and LED strips. Non-slump formula resists flow during curing. Withstands -50°C to 150°C.Compatible with dispensing guns. ISO 9001 manufactured.

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