waterproof potting material Manufacturers

TS8800 Economic 1:1 Two-Component Silicone Potting Compound, specially developed for LED drivers and power modules, offers both thermal conductivity and waterproofing. It cures at room temperature, is easy to mix, requires no special equipment, and is suitable for both automated and manual operations. After curing, it is flexible and crack-resistant, effectively protecting electronic components from moisture and dust. It offers excellent value for money, supports bulk purchases at wholesale prices, meets the stable protection needs of mid-to-low-end products, free samples are available upon request, and factory direct supply ensures fast delivery.

TS-350-1 is a lead-free high-temperature solder paste. This SnAgCu Solder Paste utilizes the Sn96.5Ag3Cu0.5 (SAC305) alloy system with a melting point of 221–227°C, specifically designed for high-reliability electronic assembly. TS-350-1 is precision-engineered with Solder Paste Type 4 (20–38μm) spherical solder powder and Solder Flux, delivering excellent printing performance and extended stencil life on the Solder Paste Printer. Prior to use, thorough mixing via a Solder Paste Mixer is recommended to ensure uniform Solder Paste Composition. This Solder Paste Lead Free product has been widely adopted in high-temperature soldering applications including telecom base stations, server motherboards, automotive electronics, and industrial controls.

TS‑503 is the ideal SnAgBi solder paste choice for LED lighting, consumer electronics, flexible PCBs, and other heat‑sensitive assemblies – providing the perfect balance of thermal protection, reliability, and cost‑effectiveness

TS107E is a widely used no‑clean, leaded solder paste that is offered in several powder size options. This article specifically covers the Type 5 version, designated as Type 5 Micro‑Powder High‑Precision Solder Paste. As a leading Solder paste type 5 product, TS107E delivers exceptional performance in ultra‑fine pitch printing and precision solder dotting applications, while also providing outstanding head‑in‑pillow defect prevention and in‑circuit probe test yield. It is ideally suited for the most demanding high‑density electronic assemblies where micron‑level resolution is critical.

TENSAN TS‑501 is a SnAgBi Alloy Solder Paste engineered specifically for SMT assembly processes that require lower reflow temperatures without compromising joint quality. Formulated with a Sn‑Ag1‑Bi35 alloy, this SnAgBi solder paste delivers a peak reflow temperature of 210–230°C – significantly lower than SAC305 – while providing excellent printability, strong wetting, and reliable electrical performance. With Type‑4 powder, ROL1 flux, and no‑clean residue, TS‑501 is the SnAgBi alloy solder paste that combines thermal protection with fine‑pitch capability and environmental responsibility.

As a fully compliant solution for environmentally conscious electronics assembly, Low‑Ionic Activator System is a high‑performance Solder flux formulated specifically for Sn42/Bi58 eutectic solder pastes. This advanced Solder flux combines a low‑ionic activator with a carefully balanced resin and solvent system, delivering exceptional printability, minimal residue, and robust electrical reliability – all while meeting the strictest global restrictions on hazardous substances. When used with SnBi alloy powder, this Solder flux enables a sharp melting point at 138 °C, supporting energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm (spanning Type 3 and Type 4), the Solder flux ensures excellent stencil release and process stability across both conventional and fine‑pitch SMT lines.