Thermal potting compound Manufacturers

Our company insists all along the quality policy of "product good quality is base of enterprise survival; buyer fulfillment will be the staring point and ending of an company; persistent improvement is eternal pursuit of staff" and also the consistent purpose of "reputation very first, shopper first" for Thermal potting compound,thermal conductive compounds,thermal potting,Thermally Conductive Encapsulant,driver thermal potting compound, Customers' benefit and satisfaction are always our biggest goal. Please contact us. Give us a chance, give you a surprise.
Thermal potting compound, Adhering to the principle of "Enterprising and Truth-Seeking, Preciseness and Unity", with technology as the core, our company continues to innovate, dedicated to providing you with the highest cost-effective solutions and meticulous after-sales service. We firmly believe that: we're outstanding as we have been specialized.

Hot Products

  • TS1001 Thermal Paste for Basic Consumer Electronics 1.0W/(m·K) - Good Insulation & Wholesale Low Cost

    TS1001 Thermal Paste for Basic Consumer Electronics 1.0W/(m·K) - Good Insulation & Wholesale Low Cost

    This 1.0W/(m·K) thermal grease is designed for lightly loaded electronic devices, such as small LED bulbs and entry-level mobile phone chargers. The soft, easy-to-apply grease allows even beginners to quickly complete installation; its stable thermal conductivity ensures devices operate at normal operating temperatures, extending their lifespan.
  • TS5505 High Thermal Conductive Silicone Sealant 1.0W/m·K , Fast Cure, Waterproof for General Electronics/LED Lighting, Factory Direct

    TS5505 High Thermal Conductive Silicone Sealant 1.0W/m·K , Fast Cure, Waterproof for General Electronics/LED Lighting, Factory Direct

    Simplify thermal interface needs: 1.0W/m·K adhesive offers reliable heat transfer for PCB assemblies and LED strips. Non-slump formula resists flow during curing. Withstands -50°C to 150°C.Compatible with dispensing guns. ISO 9001 manufactured.
  • Low-Ag Low-Void No-Clean Solder Paste

    Low-Ag Low-Void No-Clean Solder Paste

    TENSAN TS-506 is a lead-free, no-clean solder paste formulated with Sn98.5Ag1.0Cu0.5 (low-silver SAC) alloy. Designed for cost-sensitive SMT applications, it delivers excellent wetting performance, low voiding rates, and stable printability across fine-pitch assemblies. TS-506 offers a broad reflow window and leaves minimal residue, making it a reliable choice for consumer electronics, automotive modules, and industrial controls where both quality and cost efficiency matter.
  • TS8866 High Thermal Conductivity Potting Silicone 1.0 W/m·K – Waterproof Flame-Retardant Encapsulant for Power Converters & PCB

    TS8866 High Thermal Conductivity Potting Silicone 1.0 W/m·K – Waterproof Flame-Retardant Encapsulant for Power Converters & PCB

    TS8866 potting compound with 1.0 W/m・K high thermal conductivity, 1:1 two-component ratio, suitable for power converters, PCB boards, and LED driver packaging. It cures quickly at room temperature, has excellent flowability, and can fully fill tiny gaps to form a seamless protective layer. After curing, it is resistant to high and low temperatures and thermal shock, with stable thermal conductivity, accelerating heat dissipation and improving equipment stability; it is also waterproof and flame retardant, ensuring safe use. Free samples are available; direct factory sales for bulk orders, with preferential pricing for large quantities.
  • TS8833 High Thermal Conductivity & UL94 V-0 Flame-Retardant Potting Compound 1:1 – Heavy-Duty Encapsulant for LED Drivers & Converters

    TS8833 High Thermal Conductivity & UL94 V-0 Flame-Retardant Potting Compound 1:1 – Heavy-Duty Encapsulant for LED Drivers & Converters

    TS8833 Heavy-Duty Potting Compound: A 1:1 two-component design with high thermal conductivity and UL94 V-0 flame retardancy. Specifically developed for LED drivers and power converters. It has excellent flowability, penetrating deep into component gaps to form a dense protective layer. After curing, it is resistant to high and low temperatures and UV aging. Highly efficient thermal conductivity prevents component overheating, flame retardant properties eliminate fire hazards, and it offers excellent waterproof and moisture-proof performance. Factory direct supply, free samples, and customized specifications are available to meet the needs of high-end equipment.
  • SMT Red Glue

    SMT Red Glue

    Features & Benefits Tensan SMT red glue 4109A is a one-component epoxy adhesive, curing at high temperature. SMT red glue is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use

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